Transport/Handling Solution

03/01/2000

Fluoroware has launched the patent-pending JEDEC Style Waffle Pack Tray-in-Tray for chip scale packaging and wafer level packaging applications. This transport and handling solution allows waffle packs of varying pocket sizes to be used in conjunction with a JEDEC-compliant tray during assembly and test, which eliminates the need for tray retooling. The tray-in-tray solution consists of the company`s waffle pack trays, which are placed inside a JEDEC-compliant tray, allowing for interface with existing assembly and test equipment.

Fluoroware Inc.

Chaska, Minn.