Thermal-profiling Software

03/01/2000

Thermal-profiling software is now offered as an option by Radiant Technology Corp. (Fullerton, Calif.) on its full product line of ovens and furnaces used for semiconductor packaging, FPDs, hybrid thick film firing, photovoltaics and PCB assembly. The addition of this software is said to enhance ease of use and offer process-control capabilities. Real-time, on-screen profiling and profile prediction reportedly save time and labor during setup by allowing profiling to be completed with minimal passes through the equipment.

KIC Thermal Profiling

San Diego, Calif.