Interconnection Interposer

03/01/2000

The Chip-Coupler is a molecularly flexible, high-density interconnection interposer technology that differs in material and mechanical construction to the traditional flexible interposer using polyimide film. The technology reportedly eliminates the need and problems of underfill. Comparable interposers of the same interconnection density are said to cost two to three times more than the solution provided with this intrinsically flexible substrate with low-dielectric constant and dissipation.

AI Technology Inc.

Princeton Junction, N.J.