Surface Enrichment System

03/01/2000

The SE contact system enables metallized particle interconnect to interface to a tin/lead surface. SE provides a means of interfacing LGA and BGA packages to the printed wire board (PWB) and works on both tin/lead pads on the PWB and eutectic solder balls on a BGA package. SE fulfills the low profile requirement of 5 mm stack height for notebook computers and is scalable to 0.8-mm pitch in pin counts from 400 to 5,000.

Thomas & Betts Corp.

Memphis, Tenn.