Multi-use Bonder

02/01/2000

The Model 860 Omni bonder can be configured to bond flip chips, laser diodes and eutectic bonded die. The joystick-controlled system aligns and attaches die sizes from 0.006≤ square to 1≤ square at throughput rates of up to 200 placements per hour with placement accuracy of ± 5 microns. Standard features include an extend-retract cube beam splitter viewing system with illuminators and precision servo motor-driven Z motion with closed loop temperature control. A rapid heat-up stage and tool holder is provided for ramping up to 200∞C in less than 10 seconds. Bond loads of five g up to 10 kg are offered.

Semiconductor Equipment Corp.

Moorpark, Calif.