Automatic Wedge Wirebonder

02/01/2000

The H&K Bonjet 710`s open design allows for a bond area of 7.4≤ x 7.0≤, a variety of indexing systems and integration with other equipment. Other features include a high-frequency ultrasonic transducer of 100 kHz, the ability to use both gold and aluminum wire, and graphical representation of wire deformation. The product is suited for COB, hybrid, MCM, sensor and smart card applications.

Texmac Inc.

Santa Clara, Calif.