Reworkable Flip Chip Underfills

02/01/2000

Loctite 3567 is an epoxy-based liquid underfill compatible with polyimide-passivated flip chip, CSP and BGA assemblies. The product allows a flip chip to be replaced after testing determines that the chip is defective; packages can be removed by heating the package and the underfill for one minute at 210 to 220∞C, where the epoxy will begin to decompose. The adhesive cures in 5 to 15 minutes when exposed to temperatures of 150 to 165∞C, is easy to dispense and quickly penetrates gaps as small as 1 mil.

Loctite

Rocky Hill, Conn.