Moisture Protection Technology

02/01/2000

2AP, a technology that combines desiccant with injection-molded plastic, can increase yield by reducing moisture contamination to wafers and finished semiconductors in front- and back-end handling applications. The product can reduce particle emissions and can be used as a polymer substitute for waffle trays, quad mount frames and IC handling trays.

Süd-Chemie Performance Packaging

Belen, N.M.