Auburn Installs SMT/ Flip Chip Assembly Line

01/01/2000

Auburn, Ala. - With support from Cookson Electronics, Siemens and Heller Industries, Auburn University has completed the installation of an assembly line called the Laboratory for Electronics Assembly & Packaging (LEAP) for use by its engineering students. The line begins with a printer (MPM) having a paste inspection capability that also is able to print projects ranging from solder bumping of wafers and evaluations of lead-free solders for surface mount to high-temperature adhesive die attachments. A pick-and-place (Siemens) machine with direct-chip-attach follows for handling flip chip placements of 150 µm pitch plus underfills using vision. The line fills out via a nitrogen-assisted reflow system (Heller), a dispensing system (Camalot 3700) for encapsulations and a means for industrial engineering and process control studies. In addition to supporting research and development projects, the LEAP will also be used by engineers, technicians and students (graduate and undergraduate) for prototype and test vehicle assembly work to support the industry. For more information, contact Dr. Wayne Johnson at johnson@eng. auburn.edu.