Patent Report for Packages

01/01/2000

Montara, Calif. - The CSP, BGA and WLP Technology 2000 Report covers all the active U.S. patents relating to these packages, including wafer-level technologies, by summarizing and cross-referencing their characteristics. Suitable for use by companies actively involved in these packaging areas, it is said to be a valuable tool in searching for and understanding the covered ideas.

The report comes in color on CD-ROM or as a bound two-volume report ($1,995). It covers all patents through 1998; patents issued during 1999 will be summarized and combined with the previous reports into a final manuscript that will cover all patents up to 2000. For more information, contact Linda Jardine at International Interconnection Intelligence, (650) 728-5270 or iiil@ix. netcom.com.