Two-metal Substrate Development Underway

01/01/2000

San Jose, Calif. - Korean substrate maker LG Electronics Inc. has agreed with Tessera Inc. on a deal to use the latter`s basic chip scale package technology to make and market two-metal-tape substrates for high pin count applications, such as those for application-specific integrated circuits and digital signal processors. Though the operation will be run by LG at Tessera`s site in San Jose, the two companies will cooperate in staffing the activity until the fully developed process may be transferred to Korea where it will go into high-volume semiconductor assembly production.