And the Award Winners are ...

01/01/2000

Mark Diorio

Recently, two distinguished colleagues were presented the First Annual MicroElectronics Packaging Technologist Award for their significant contributions in the advancement of packaging technology. The award was co-sponsored by Advanced Packaging magazine and MEPTEC and was presented at the recent MEPTEC 1999 Symposium in San Jose, California. While you undoubtedly know Advanced Packaging magazine, some readers may not be familiar with MEPTEC - a Silicon Valley organization dedicated to semiconductor packaging engineering and testing that is composed mostly of Silicon Valley`s best and most prominent packaging technologists and test engineers. During the past few years, the organization has been extended to the Phoenix and Austin areas. Previously known as the MicroElectronic Packaging and Test Engineering Council, it was originally organized by Silicon Valley engineers involved in packaging and testing to create a forum whereby they could discuss important industry issues. Unlike many larger trade associations, MEPTEC focuses on the individuals and the companies they work for.

Both MEPTEC and AP advisory boards reviewed the award nominations. Criteria for selection consisted of a significant and outstanding contribution to the packaging industry in the following areas: 1) pervasiveness of the technology; 2) enabling of advances in the field of packaging or assembly of semiconductors; and 3) cost reduction coupled with improved reliability and concepts that allow breakthrough revolutionary events. This year`s recipients were Maniam Alagaratnam (LSI Logic) and Dr. Thomas DiStefano (Decision Track). Both were worthy and equally deserving of the award. As I have worked closely with both individuals, I would like to share my perspective on their efforts.

Maniam Alagaratnam has almost 30 years of experience in semiconductor packaging and is currently the vice president at LSI Logic. His responsibilities include advanced package design, new product development and new process development. In addition, he oversees all of LSI`s worldwide assembly operations and sustaining packaging engineering efforts. Maniam`s group at LSI is composed of about 50 to 60 engineers and high-caliber technologists with a variety of backgrounds and disciplines.

Maniam was recognized for his efforts in the advancement and commercialization of flip chip (FC) packaging. Maniam spearheaded the implementation of reliable, high-volume production of FC devices on organic laminate substrates. Most interesting is that, unlike many nominees, Maniam worked diligently on the development of the industry`s infrastructure to allow for complete embracement of the technology by our industry. I think that many engineers are good at "inventing" things, but many times these inventions are not realized because the appropriate (and more demanding) effort was not put into the infrastructure development required for the invention to flourish. Infrastructure development is the single most limiting item in the advancement of any new technology by the market and one that "Notes from the Floor" has strongly advocated since inception.

Tom DiStefano was recognized for his efforts in the advancement of chip scale packaging (CSP). Most of us recognize Tom as being one of the co-founders of Tessera, and while he is listed on a large number and variety of CSP patents, his efforts in promoting CSP to the market are unsurpassed. While it was the selection committee`s judgement that Tom`s recognition and invention of stress buffering of BGA solder balls and its impact on device reliability was merit enough for the award, I personally feel that Tom put CSP a generation ahead of where it would have been if it were just left to flourish on its own (or by our own individual roadmap executions). The acceptance of CSP is largely because of Tom`s efforts to not only help develop the infrastructure to supply, but also in stimulating the demand of the market (end-users) for CSPs.

While both award winners deserve recognition for their efforts, I think they also deserve a vote of thanks. Their efforts have significantly helped our industry embrace new applications and adapt current technologies, and have created numerous and rewarding opportunities for a variety of people and suppliers. They have helped to pave the way for our continuously quickening pursuit of advanced packaging.

MARK DiORIO, chief operating officer, can be contacted at MTBSolutions Inc., 2685 Marine Way, Suite 1220, Mountain View, CA 94043; (650) 960-3203; E-mail: [email protected].