Desiccant Injection-molded Plastic

01/01/2000

Designed to protect microelectronics from moisture contamination, 2AP is a technology that combines desiccant with injection-molded plastic for OEM components, packaging and handling systems. The product is said to increase yield in the traditionally low-yield microelectronics industry by reducing moisture contamination of wafers and finished semiconductors in front- and back-end handling applications. It reportedly incorporates the moisture-eliminating characteristics of desiccants with the durability, cleanroom and molding qualities of plastic.

United Desiccants

Belen, N.M.