Low-viscosity Encapsulant

01/01/2000

Tra-Cast 521H01 is for microelectronic component encapsulating and underfill applications. It reportedly has flow and wetting properties that make it suitable for underfilling components that require adhesion, low shrinkage and low ionic content. The encapsulant is designed for high-reliability applications where capillary action is desired. When fully cured, this adhesive is said to be an electrical insulator with impact- and thermal-shock resistance.

Tra-Con Inc.

Bedford, Mass.