High-purity Underfill Encapsulant

01/01/2000

ME-525 is a high Tg, low CTE, high-purity underfill encapsulant designed for use with small-gap flip chip devices. The product is said to penetrate gaps as small as 2 mils and cure in 30 minutes at 150°C. Easy to dispense and with high chemical and moisture resistance, the product has low viscosity, high flow for capillary chip underfill and is capable of flowing under a 1/4" die in less than 60 seconds.

Thermoset

Lord Chemical Products

a division of Lord Corp.

Indianapolis, Ind.