Non-anhydride Flip Chip Underfill

01/01/2000

Amicon E 1158 flip chip underfill encapsulant is said to cure in five minutes at 135°C and can sustain more than 3,000 thermal shocks from -55°C to 125°C with no delamination. The product is highly flowable, non-anhydride-based and designed to fill gaps of 50 or more microns. It reportedly exhibits good adhesion to common die passivations.

Emerson & Cuming

a National Starch and Chemical Co.

Billerica, Mass.