News
11/01/2001
Kyocera introduces build-up packages for lead-free processing
SAN DIEGO - Kyocera America Inc. has introduced the industry's first flip chip build-up substrate that is capable of withstanding 260°C solder reflow, which is necessary for lead-free processing. The high-density build-up (HDBU) package has been qualified by multiple IC suppliers and assembly subcontractors, and is in volume production today.
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Kyocera's semi-additive build-up process provides the densities needed for high pin count flip chip products. Commercial products are available in 200-µm flip chip bump pitches, with 25 µm lines, 27 µm spaces and 50 µm laser vias.
"The industry is currently requiring a lead-free solder solution, however most build-up packages can't withstand the necessary 260°C reflow," said Fritz Johnson, organic sales manager for Kyocera's Microelectronic Packaging Division. "Kyocera anticipated the need for a lead-free solder solution on build-up packages and our flip chip build-up substrate is the first in the industry."
Verification of the HDBU substrates was performed by preconditioning at JEDEC level 3 (30°C/60%RH/192 hrs), then passing a 260°C reflow profile a total of three passes. The substrates exhibited no blisters, voids, delamination, electrical opens or shorts, or increase in trace resistance. The test package used was a 1280-pin ball grid array with 40-mm body size and three build-up layers on each side of the core (3/2/3 construction).
Kyocera will now focus on working with customers to test the performance of various qualified underfill materials and die-mounting processes to evaluate the performance of fully assembled packages under 260°C solder reflow conditions. HDBU substrates for flip chip packaging are manufactured at Kyocera's Sendai and Kokubu factories in Kagoshima, Japan.
Zuken introduces new packaging tool and roadmap
WESTFORD, MASS. - Zuken USA has recently introduced an advanced packaging roadmap to address performance and manufacturing issues during the design phase. The product roadmap includes plans for a complete synthesis approach for automation concepts, including routing and pre-routing, enhancements to the menu flow, data input and library, and embedded real-time signal integrity analysis.
Complex and very high-speed packaging technology will need to include the ability to analyze signal integrity and RCL values on the fly. Zuken's newest advanced IC packaging solution, Package Synthesizer, provides an integrated environment for designing single-, multi- and stacked-die packages for BGA, CSP, flip chip and high-density advanced technology substrates. It features enhanced 3-D capabilities, real-time analysis and tighter integration with IC tools for design and analysis verification.
 Whole view of a BGA MCM with stacked-die bond shell diagram (inset). |
The tool combines die and ball pattern component generation, substrate outline creation, netlist input and technology type into a single step. The BGA start-up tool automatically places components, assigns design and technology rules, and readies the package for bond shell generation (or routing, in the case of flip chip technology).
The 3-D Design Rule Constraints (DRC) enable JEDEC-standard wire bond profiles to be automatically checked for interference with adjacent wire bonds. Wire profiles are checked per precise manufacturing processes, which eliminates design delays as a result of additional manufacturing checks at the wire bond facility.
Sumitomo offers online ordering for opto packages
OSAKA, JAPAN - Sumitomo Electric Industries Ltd. (SEI) has started an online ordering service for semi-custom optoelectronic packages that aims to shorten lead times between designing and shipment, as well as reduce prices.
An optoelectronic package is generally composed of about ten parts. At the start of SEI's service, three options are provided for each part so that a customer can make the best choice according to required characteristics and applications. The components available on the Internet order service are versatile and are suitable for 2.5 Gbps transceivers, transmitters, receivers and pump lasers.
This new system will enable shipment in two weeks or less, which is less than half the time of conventional product shipment. Sumitomo reports that their new system allows the price level of mass-produced products, and that optional minor changes will be available at an additional charge. AP