Briefly Speaking

07/01/2001

Semitool receives patent for copper seed layer enhancement

Semitool (Kalispell, Mont.) has received a patent for copper seed layer enhancement, an advancement in technology that will help semiconductor device manufacturers achieve high-performance devices and smaller chips from copper interconnect-based semiconductor devices. The seed layer enhancement technology can extend the application of copper to design rules beyond 0.1 micron.

Copper seed layers are deposited on silicon wafers during the manufacturing process by physical vapor deposition (PVD). The minimize seed layer discontinuity, PVD layers are typically deposited at a thickness on of 1,000 ÅÅ. However, a thick PVD layer can lead to overhang of the deposited material. The patented seed layer reduces this thickness to eliminate overhang.

Advanced photonic report series

ElectroniCast, a forecaster for the fiber optic, optoelectronic and photonic industries, is offering a new, continuing six-part series of reports of optical communication advanced photonics. Published in two-month intervals, the first report will cover optoelectronic application specific integrated circuits in August 2001. Each volume will describe applications, technology trends and consumption. The series of six reports is available for $9,950. For information, contact Theresa Hosking, 650-343-1398; Fax: 650-343-1698.