Pursuing excellence
03/01/2001
There are a few things I can count on hearing when I talk it up with folks in the industry. Among the general niceties people bestow upon us, there is always a mix of good questions, such as "When are you going to cover such-and-such topic?" and "Does this product really work?" And then there is my favorite: "When are you guys going to do an awards program for the industry?"
Well, we've heard you and heeded your call.
And when we decide to do something at Advanced Packaging magazine, we don't fool around: The Advanced Packaging Awards will commence this year and winners will be announced on July 18 at the 2001 SEMICON West show in San Jose, California. The organizers of SEMICON West have kindly endorsed the program, and we have secured an experienced and unbiased panel of judges who are immersed in the industry, including individuals from highly esteemed university programs and consortiums.
Celebrating product excellence in semiconductor packaging, there are 12 categories in which companies may enter: wafer dicing, die placement and attach, wire bonding, encapsulation/molding, interconnection, lead forming, solder bumping, test and inspection, laser marking and singulation, packing and shipping/distribution, software, and contract services.
Now It's Back in Your Court * Nomination entries are due Monday, April 2. You can print an entry form from our Web site (www.apmag.com), or we'd be happy to send one to you if you drop us a line.
All too often, people are not recognized for the efforts they and their companies put forth to advance an industry. It is our hope that by honoring these individuals, we will continue to underscore the importance of innovation.
So, answer this call to showcase product excellence by participating in the debut of The Advanced Packaging Awards competition. And the next time people ask me about a packaging awards program, I'll have a great answer for them.
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Until next month,
Amy Knutson-Strack
Editor
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