EtroniX preview
02/01/2001
EtroniX is a multi-disciplinary event that will feature automated design tools, components, test, production, packaging and more. The conference will be held February 25 - March 1, 2001, and the exhibition will take place February 27 - March 1, 2001, at the Anaheim Convention Center (Anaheim, Calif.). The following is a sampling of products that will be showcased at EtroniX. After reviewing the products of interest, circle the corresponding numbers on the reader service card to receive more information. For faster results, fax the card to 413-637-4343. For more information on EtroniX, visit www.etronixexpo.com.
X-ray Inspection System
The FXS-160.40 Microfocus X-ray inspection system is designed to meet the needs of the PCB manufacturing industry and is suitable for off-axis inspection of planar devices. The detector can be rotated 360 degrees and angled up to 50 degrees for complete oblique angle viewing without sample repositioning. The latest "high-brilliance" X-ray tube design is said to provide vibrant image resolutions to less than 2 µm with geometrical magnifications up to 200X at any inspection angle. FeinFocus USA Inc., Stamford, Conn.
Telecom Tool Kit
The Microelectronic Packaging Engineer's Tele com Tool Kit is for designing and packaging products that operate at high frequencies. It reportedly assists with the challenges of increasing usable frequency by reducing the IC/package size, increasing the power driven through the circuit, and reducing insertion and return losses. The kit includes tools for packaging high-frequency products for the telecom/datacom market, such as automated eutectic die attach, "relative to" die placement, ribbon wire first-level interconnect, constant wire-length looping, very short wire-length looping and high-frequency ultrasonics. Palomar Technologies, Vista, Calif.
Bonding/Rework System
The Model 850 Flip Chip Bonder is designed for process development and low-volume production runs requiring ± 12 µm placement accuracy of flip chips, chip scale devices and bare die on circuit boards and flex circuits. Features of the Model 850 include cube beam splitter with illuminators, micrometer adjusted stage, hot gas spot heating with closed-loop temperature control and a heated stage capable of 350°C. The Model 850 is equipped with the Model 870 attachment, which is said to remove flip chips that have been bonded using reworkable underfill materials. The attachment includes a focused chip heat source for spot heating to melt the solder and break down the underfill. Semiconductor Equipment Corp., Moorpark, Calif.
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Wafer Shipping System
The Horizontal Wafer Shipping System reportedly provides secure protection for shipping of 150 mm or 200 mm finished wafers with a thickness down to 150 µm. The system features a 25 full thickness wafer capacity and is constructed of carbon powder polypropylene material, which provides protection from ESD and physical damage. Other features include independent, inside wafer retaining walls to buffer from impact to the outer sides of the box. The unit is automation compatible, with a 50-mm access zone between the inside retaining walls for machine pickup armature access. Assembled size is 226 x 226 x 70 mm. Entegris, Chaska, Minn.
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Stereomicroscope
The StereoZoom line of stereomicroscopes reportedly delivers distortion-free images and features a 36.5-mm field of view. The single cam design is said to provide smooth, precise magnification control. The magnetic mounting system maintains proper alignment of the internal optics, and the outer shells provide protection against ESD. A 38-degree ergonomic viewing angle allows proper posture during use for more comfortable viewing. Leica Microsystems Inc., Deerfield, Ill.
CSP Adhesive
CornerBond 3515 adhesive is designed to minimize the effect of induced stresses between the PCB an the array package. This adhesive is ideal for CSPs with interposers or cornerless arrays. CornerBond can be applied using standard SMT dispense equipment and cured during the solder reflow cycle. The product is a single-component liquid epoxy adhesive with a relatively high curing temperature. Loctite Corp., Rocky Hill, Conn.
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Ribbon Bonder
The K&S Triton Series ribbon bonder is an automatic wedge bonder designed specifically for ribbon bonding. The bonder reportedly combines fast cycle speeds (for 1 mm high x 10 mm thick wires) with deep access capabilities and a fully automatic material handling system. This ribbon bonder is said to provide bond characteristics and electrical performance for devices used in the wireless product market, telecommunications and computer peripherals applications. The Triton Series has 1 inch of bondhead Z stroke and deep access, 90-degree wire-feed angle that enables bonding of packages with deep cavities, and large downsets. Kulicke & Soffa, Willow Grove, Pa.
Vacuum/Gas Bag Sealer
The ElectroPac vacuum/gas bag sealer reportedly features bioactive seal jaws with a 5/16-in. wide seal in lengths from 12 to 54 inches. Independent temperature, time and pressure controls are said to ensure seal integrity, and a ported exhaust provides one output for venting all exhaust air outside the cleanroom. Safety features include a clear, lockable control box cover, automatic jaw interference release system and emergency stop button. Packaging Aids Corp., San Rafael, Calif.
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Inspection System
The NXR-1500Plus X-ray inspection system provides a high-resolution, high-power, 4-axis system for inspection of large, densely populated PCBs. Featuring 800X variable magnification combined with 5 µm resolution, the NXR-1500Plus is suitable for inspection and verification of large boards up to 18 x 24 inches using BGAs, flip chips, µBGAs and other high-density, hidden connection devices. Other features include 4-axis manipulation with standard rotation control, dual-field image intensifier and image processing software. Nicolet Imaging System, San Diego, Calif.
Circuit Board Cutter
This laser circuit board cutter is said to be designed specifically for cutting or scoring both fiber and ceramic PCBs. The system reportedly provides edge cutting of circuit boards without charring. Point and click operation allows for pre-programming of the cutting path on CAD or other graphics programs. Online Inc., McHenry, Ill.
Package Designer
The Encore-IC Package Designer is suitable for the design and analysis of single and few-chip BGA/CSP style package designs using wirebond and flip chip technologies. Features include design accuracy using continuous online rule checking, increased design throughput with wirebond functionality and auto-routing technology and built-in electrical advisors. The design data is reportedly compatible with all major package manufacturers. Avant! Corp., Victor, N.Y.
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Solder Paste
R276 is a syringe dispensable no-clean solder paste designed for all types of dispensing applications. The paste is processed and packaged void-free to ensure consistent dispensing in high-speed automated processes. Reportedly featuring a rate of four dots per second, R276's flexible reflow profile makes it an ideal paste for contract manufacturers and other electronic assembly companies that run low-volume and high-product-mix lines. Kester Solder, Des Plaines, Ill.
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Fluxless Soldering Process
This environmentally benign fluxless soldering process called fluorinated soldering technology (FST) is said to expose parts to a pure gas phase treatment that enables solderability without the use of flux. FST is reportedly effective for up to two months, allowing treated parts to be shipped or stored and joined at a later time. FST treated parts show wetting times up to 11 times shorter than flux treated parts, according to the company. FST has been enabled in two types of systems: a high-volume continuous belt machine and a smaller R&D machine. Advanced Manufacturing Technologies, Flat Rock, N.C.
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Adhesive Film
This Die-Attach Film Adhesive reportedly eliminates long curling hold-down times typically required to ensure quality bonding integrity. The film can be tacked and induced to flow onto heated substrates with placement pressure during pick-and-place processes. After the die is tacked onto the substrate, placement tools can be removed and the device continues to cure without any hold-down mechanism. The film is said to maintain position during cure with heat at 100 to 150°C for less than 5 minutes. AI Technology, Princeton Junction, N.J.
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Vision Inspection System
The RTI-7500 uses high-resolution cameras to check solder joints and verify part installation. A mega-pixel camera reportedly provides color inspection capabilities. The system is said to facilitate quick, accurate and non-destructive inspection of PCBs. Capable of accommodating up to 18 x 20-in. PCBs, the system can be installed over an existing production line. Defects are reported on the image screen and logged onto the defect file for rework. CR Technology, Aliso Viejo, Calif.
AP