Kicking off 2001
01/01/2001
Beginning a new year always conjures up all sorts of resolutions... organizing your desk (because it might be condemned by the local fire marshal)...eating the "right" foods (we'll bypass the whole dieting thing altogether)...maybe even setting aside more savings (so we can retire sooner?).
 |
By now some such resolutions may already be in your not-so-distant past. But one resolution the staff at Advanced Packaging magazine would like to add to your list is to write for your colleagues in the packaging industry. Whether it's expressing an opinion about business and technological developments in "Industry Voices," talking about trends and strategies in contract manufacturing in "Partners in Manufacturing," or writing a full-fledged technical article, we are here to help you through the process.
Take a look at the sample of topics in the box to the right that we plan to cover this year in the magazine...of course if you have another idea, let us know!
Also this year you can look forward to more news about what's happening in the industry. This month, check out a story on Motorola's BAT-1 facility. As always, we look forward to working with you in the future. Here's to 2001!
Until next month,
Amy Knutson-Strack
Editor
300mm Wafers, Adhesives & Epoxies, Assembly, Operations, BGA, Cleaning Materials & Equipment, Component Placement, CSP, Design Standards, Design Tools, Die Handling, Dispensing/Coating, Embedded Passives, Encapsulation, Encapsulation/ Underfill, Known Good Die, Lasers, Lead Frames & Sockets, Lead-free, Microwave/RF, Packaging Materials, Packaging Polymers, Repair & Rework, Socketing, Solder, Soldering Equipment & Materials, Substrates, System-on-a-Chip, Thermal Management, Thick & Thin Film, Wafer Scale Manufacturing, Wireless & Communication Applications.
Do you have a question, comment or request? Here are your contacts for some frequently asked questions. The staff at Advanced Packaging magazine and PennWell Publishing will be happy to assist you.
Feature Submissions
Letters to the Editor · Editorial Focus · Editorial Lineups · Author Guidelines · Copyright Permissions
Contact: Amy Knutson-Strack, Editor
· Advanced Packaging Editorial Offices
430 North Milwaukee Avenue, Suite 10
Lincolnshire, IL 60069
* Tel: 847-876-5610
· Fax: 847-634-4240
· E-mail: [email protected]
Press Releases
Industry News · Calendar Updates · New Products · Covers
Contact: Kathleen Peterson, Assistant Editor
· Advanced Packaging Editorial Offices
430 North Milwaukee Avenue, Suite 10
Lincolnshire, IL 60069
· Tel: 847-876-5608
· Fax: 847-634-4240
· E-mail: [email protected]
Subscriptions
Change of Address
Contact: Omeda Subscription Services
· Tel: 847-559-7500
· Fax: 847-291-4816
· E-mail: [email protected]
Photocopies
Permission to photocopy for internal or personal use, or the internal or personal use of specific clients, or for educational use, is granted by PennWell Corp., provided that the appropriate fee is paid directly to CCC, 222 Rosewood Drive, Danvers, MA 01923; 978-750-8400.
Microfilm Copies
Microfilm copies of Advanced Packaging may be purchased from University Microfilms, 300 North Zeeb Road, Ann Arbor, MI 48106