Briefly speaking
01/01/2001
AIT online info center
Advanced Interconnect Technologies (AIT) now offers a new Web site at www.aitsales.com. The site includes company and product information, reports and data sheets, assembly and test capabilities, and quality standards and systems. Customers can have direct contact to the manufacturing floor by using the Customer Center option.
3M package acquisition
3M has recently acquired the Eau Claire, Wisconsin-based single chip module substrate business (also known as the high-density, multi-layer integrated circuit packaging business) of W.L. Gore & Associates. The transaction is dependent upon regulatory approvals. Financial details have not been disclosed.
"This business is an important strategic fit, complementing our integrated circuit packaging business," said Rich Iverson, vice president of 3M's Electronic Products Division. "When coupled with the 3M flexible circuit business, it extends our technological offering, providing one of the most comprehensive portfolios in IC packaging. We're excited about this opportunity, which provides both parties broader solutions to our customers in high-end computing and telecommunications."
"We believe this is a win for both 3M and Gore," said Dan Johnson of W.L. Gore. "We look forward to continuing to work with 3M and other customers in advancing electronic materials technology." Gore will continue to be a supplier to 3M for MicroLam dielectric materials.
The 300+ person business unit becomes a part of the 3M Electronic Products Division. The Austin, Texas-based 3M division manufactures Microflex circuits for inkjet printers, hard disk drive applications and a variety of IC packaging applications, as well as other applications, such as medical equipment and displays.
3M is naming Paul Fischer business unit director to continue to head the organization. This business will continue to be located at its Eau Claire location and operate as part of 3M's Electronic Products Division.
Thermacore reports record year
Thermacore International Inc., a leading designer and manufacturer of thermal management solutions, has experienced 60-percent sales growth over the past year, reporting record sales for the fiscal year ending June 30, 2000. The company has expanded internationally, boasting sites in Lancaster, Pa.; Tucson, Ariz.; Mexico; the United Kingdom; Taiwan; and Korea. Thermacore has also augmented its sales force to include independent sales representatives worldwide.
Thermacore's Lancaster, Pa., plant recently received ISO 9001 certification, while the Korea facility is ISO 9001 certified and the Taiwan facility is ISO 9002 certified. Other Thermacore operations are in the process of becoming registered to ISO 9001 and ISO 9002 standards.
Additionally, Thermacore celebrated its 30th anniversary in September. The company has 54 patents in the thermal design area.
Schott and NEC form joint venture
Schott Glas (Mainz, Germany) and NEC Corp. (Tokyo) have formed a new production joint venture for the hermetic packaging of key electronic components. The partnership strengthens Schott's position in the packaging market and is another step for NEC in the reorganization of its group-wide structure.
The production joint venture, NEC Schott Components Corp., began operations on October 1, 2000, with 340 employees. Headquarters is located in Ohtsu and production is in Minakuchi (both are in Japan's Shiga Prefecture).
The new company (NEC 51 percent, Schott 49 percent) plans sales of up to 9 billion yen ($82 million) by the end of 2001. The joint venture company will merge the hermetic seal production assets from NEC's Minakuchi plant and Schott's electronic packaging sales and distribution operation in Japan to offer customers packaging technology for high-end electronic components. With the research capabilities of both parent firms, NEC Schott Components plans to develop new products and technologies, especially for applications in opto-electronic and automotive sectors. Schott's Electronic Packaging Division has two production facilities in Asia (one in Singapore and now one in Japan). Other manufacturing sites are located in Germany, the Czech Republic and the United States.