EEMS Expands 300 mm Packaging Capability

10/01/2002

RIETI, ITALY — Assembly and test subcontractor EEMS Italia Spa is increasing its 300 mm capabilities by placing a repeat order for a 300 mm dicing and grinding system from Disco Corp. of Tokyo.

The equipment uses a "dicing before grinding" approach that dices through a portion of the wafer's thickness and then grinds from the backside to thin the wafer as well as singulate the devices. This is one of the processes currently used in the industry to reduce the stress, warpage and chipping in thin wafers that result from conventional thinning and singulation technologies.

EEMS, a leading European subcontractor, was founded in 1994 as a spin-off from Texas Instruments. The company provides a broad range of packaging services, including assembly and test of high-speed DRAM products.