New products
09/01/2002
For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.
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Bump and Measurement System
BIS 200 is a fully automatic surface 2-D inspection and bump 3-D measurement system. Developed as a total inspection solution for both the bumping process and yield enhancement, the system combines 2- and 3-D measurements with a data acquisition feature for recording the inspection results, enabling retrieval and analysis of the bumping process. Capabilities include 100 percent inspection of 2 to 12" wafers, flexibility with process variations, as well as measurement of all bump types regardless of bump or surface materials. Camtek, Sunnyvale, Calif. For free data, circle 206 or visit www.onlinecenter.to/ap.
Interface Material
T-Ima is a multilayer metallic phase change material that has a thermal conductivity greater than 18 W/mK. The material is said to provide an ultra-low thermal resistance of 0.015°C-in2/W or less at 5 psi, and also is available in phase change temperatures of 60°, 72° and 108°C. Thermagon Inc., Cleveland, Ohio. For free data, circle 200 or visit www.onlinecenter.to/ap.
Simulation Software
Capable of solving 3-D applications that involve voltage or current sources with arbitary waveforms important for the design of non-destructive evaluation, MRI and power-transformer equipment, Maxwell 9.0 can calculate core loss, including the eddy, excess and hysteresis loss of materials. New 3-D thermal capabilities also provide steady-state thermal analysis capability, and one-way coupling between Maxwell's AC magnetic module and thermal field analysis. Ansoft Corp., Pittsburgh, Pa. For free data, circle 201 or visit www.onlinecenter.to/ap.
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Visible Spot Cure System
Acticure 4000 is a UV/visible spot cure system for automated and manual precision assembly environments. The light-based curing system has an increased lamp life of 2,000 hours and more than 20,000 mW/cm2 of curing power. Output intensity can be adjusted from the user-friendly front panel and locked into place. EXFO, Quebec City, Canada. For free data, circle 202 or visit www.onlinecenter.to/ap.
Tape Splicer
TS-100 is a lightweight, portable tape splicer capable of splicing tape widths of 8, 12 or 16 mm. Its versatility offers use on both embossed or paper-punched carrier tape. The system also provides splices without any empty pockets between and through sprocket holes. V-TEK Inc., Mankato, Minn. For free data, circle 203 or visit www.onlinecenter.to/ap.
3-D Inspection System
An in-line 3-D vision inspection system for singulated area-array packages, FalconPro performs in-process inspection, consisting of inspecting IC packages directly after solder ball reflow, connecting easily to the line at the exit of the furnace via conveyor. The inspection system also features proprietary Fast Moiré Interferometry technology, which uses a single light source and a single high-resolution digital camera to obtain X, Y and Z data for each pixel in the field of view. SolVision, Longueuil, Canada. For free data, circle 205 or visit www.onlinecenter.to/ap.
Component Mounter
A Wafer Feeder option is available for the company's Topaz-XiII and ACM component placement machines. The new feeder enables manufacturers to bring wafer feeding on-line at low cost per placement. It also reportedly can handle wafers from 5 to 8". Additionally, five tool bits cover a range of die sizes from 2.5 to 18.0 mm2 and 0.07 to 0.5 mm thickness. Assembléon, Eindhoven, The Netherlands. For free data, circle 207 or visit www.onlinecenter.to/ap.
Electronics Cooling Software
Icepak 4.0 is a new version of electronics cooling simulation software that delivers fast time-to-solution through its combination of nonconformal meshing and unstructured meshing strategies, including assembly meshing. The software's meshing technology allows users to isolate the mesh in the IC package from the rest of the system. The software also introduces an intuitive user environment, featuring a model manager, advanced object wizards, alignment tools and four-window simultaneous views. Fluent Inc., Lebanon, N.H. For free data, circle 209 or visit www.onlinecenter.to/ap.
Calibration/Flow Instruments
Series 520 of calibrated leak/flow standards are available in five mounting assemblies including, I-Inline Assembly, G-General Assembly, 21-Straight Thread Assembly, C20-CPC Assembly and C20F/C-Miniature Assembly. The instruments are said to be individually sized and manufactured to ISO 17025, within 0.5 to 50,000 sccm and within -14.7 to 500 psig range. Each calibrated orifice is said to be certified as an air leak or flow standard in the company's A2LA accredited laboratory and sealed in a specified mounting assembly. Cincinnati Test Systems Inc., Village of Cleves, Ohio. For free data, circle 210 or visit www.onlinecenter.to/ap.
Benchtop Inspection System
Bench|mate inspection tool is a high-resolution, microfocus X-ray system that delivers high-contrast inspections of various samples from PCBAs to organic specimens. The 25 x 17.3 x 21.7" base unit reportedly comes with a 90 kV microfocus tube and a scanning area of 6 x 6" with a sample weight of more than 1 lb, providing good microfocus images of manufacturing errors. phoenix|x-ray Systems + Services Inc., Camarillo, Calif. For free data, circle 214 or visit www.onlinecenter.to/ap.
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Video Inspection Workstation
Saturn is a video inspection workstation using CCD sensor technology to achieve unparalleled images. The workstation spans a range of application-specific inspection solutions. Some features include variable magnifications that range between 1.75 to 168X, a working distance of 6 to 26" and a depth of focus beyond 5". Intelligent Vision Solutions, Sonora, Calif. For free data, circle 213 or visit www.onlinecenter.to/ap.
Machine Vision System
Visionscape 4000 series is scaleable and features a flexible camera interface, ensuring compatibility with almost any industrial machine vision camera. Additionally, up to 10,000 balls per second at 100 percent inspection is possible. It also features ball placement accuracy at 0.002" per pixel with 0.0005" at 3 sigma and ball diameter accuracy at 0.002" per pixel with 0.0008" at 3 sigma. RVSI, Tucson, Ariz. For free data, circle 216 or visit www.onlinecenter.to/ap.
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Microvia Drilling Technology
HyperVia holographic microvia drilling technology is designed for drilling current and next-generation high-density 3G smart chip carrier packages. This technology is said to be capable of producing microvias on randomly pitched grid arrays at process rates exceeding 100 percent faster than current laser systems. NanoVia LP, Londonderry, N.H. For free data, circle 211 or visit www.onlinecenter.to/ap.
Carrier Tape
A type of carrier tape for bare die and chip scale devices, Micro-Tape was designed and manufactured specifically for thin (less than 1.5 mm) devices, and suits all types of tape-and-reel machines as well as pick-and-place machines. The tape is made to the dimensions of the device to ensure good fit, and both sides of the cover tape are fully transparent. Advanced Integrated Materials, Reel Service Group Div., Santa Clara, Calif. For free data, circle 217 or visit www.onlinecenter.to/ap.