Shining Stars of the Industry
09/01/2002
Second Annual Advanced Packaging Awards
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The winners of the 2002 Ad- vanced Packaging Awards were announced at a special reception during the first evening of SEMICON West in July. A standing-room- only crowd of more than 200 - noticeably more than at last year's inaugural event - were the first in the industry to learn which company's products most impressed Advanced Packaging's panel of independent judges. Stan Meyers, SEMI's president and CEO, kicked off the event with his thoughts on the importance of innovation in the packaging industry.
The program, launched by Advanced Packaging Magazine last year and co-sponsored by SEMICON West, was held in the Fairmont Hotel in San Jose on July 17. Advanced Packaging assembled a group of 13 prominent figures from industry and academia to evaluate the relative merits of 82 products submitted in 14 categories. The criteria included innovation, cost-effectiveness and throughput among others, and products had to be introduced between April 1, 2001 and March 31, 2002 to be eligible for an award.
Advanced Packaging's Publisher John Bubello and Editor-in-Chief Jeff Demmin announced the winners to the crowded room of party-goers, and several awards were being displayed proudly on the show floor the following day. Advanced Packaging congratulates and thanks all winners and participants in the 2002 Advanced Packaging Awards program and recognizes each participant's part in keeping this constantly changing industry at the forefront of excellence.
Information about the 2003 Ad vanced Packaging Awards will be posted at www.apmag.com when it is available.
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Advanced Packaging Publisher John Bubello welcomes the standing-room-only crowd to the second annual Advanced Packaging Awards ceremony.
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Stan Meyers, SEMI's president and CEO, kicked off the event with his thoughts on the importance of innovation in the packaging industry.
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2002 winners of the Advanced Packaging Award. Winning products were chosen from 82 products in 14 innovative categories.
Congratulations to the Winners of The 2002 Advanced Packaging Awards
Imaging/Inspection Equipment · August Technology
3Di-8000
Die Placement & Attach · ASM Pacific Technology Ltd.
AD8912 Automatic Die Bonder
Handling Equipment & Fixtures · BTU International
Automation for Wafer Bump Reflow
Flip Chip Processes, Materials & Products · Despatch Industries
AST-1100 Automated Photoresist Bake Tool
Surface Treatment Equipment · March Plasma Systems
XTRAK In-line Plasma Treatment System
Quality Management Tools · RVSI
HawkEye 15E
Functional Test Equipment · Gryphics Inc.
BGA Socket
Encapsulation/Molding · ASM Technology Singapore Pte. Ltd.
IDEALmold Application - Pinnacle Gating System & Soft Technology
Thermal Management · Tiros Corp.
Ultima Vertical Curing System
Package Design & Analysis · Kyocera America Inc.
ClamShell
Wafer Dicing/Thinning · Disco Hi-Tec America
DF8140 Fully Automatic Polisher
Wire Bonding · Kulicke & Soffa
Maxum Ball Bonder
Specialized Advanced Packaging Products · Amkor Technology
3+ Die Stacked Chip Scale Package
Substrate & Submount Materials & Technologies · Rogers Corp.
ZYVEX Liquid Crystalline Polymer
Advanced Packaging Magazine's Publisher John Bubello and Editor-in-Chief Jeffrey Demmin congratulate various winners on their award-winning products.
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