C-MAC Launches Integrated Opto Module Program
08/01/2002
DURHAM, N.C. - C-MAC MicroTechnology filled out its optoelectronic manufacturing technology portfolio and now offers an integrated assembly and test program for those applications. The initiative, dubbed ATOM (advanced technology for optoelectronic modules), includes optical fiber alignment and splicing, low-temperature co-fired ceramic (LTCC) structures, chip-and-wire assembly, and hermetic sealing.
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LTCC is a critical part of the technology according to C-MAC. LTCC technology allows electrical and physical properties to be customized in structures up to 75 layers. There is a low-loss formulation that can be used to improve signal integrity and transmission. The rigid LTCC structure also provides a stable base for enhanced ultrasonic coupling during wire bonding, which improves the process window for wire bonding on fragile GaAs and InP devices. For thermal management, thermoelectric coolers can be embedded in the LTCC.
C-MAC also is looking at expanding the capabilities of LTCC with optical interconnect. According to Bob Hunt, technology development manager at C-MAC, they are "exploring the use of LTCC-embedded polymer waveguides to provide optical routing within the ceramic substrate itself."