New Products
03/01/2002
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Pick-and-Place System
System A45 is an automatic pick-and-place system designed to handle wafers up to 8-inches with low pick-up force and features an improved ink dot and wafer mapping capability. The system offers wafer mapping, various linear picking patterns, and ink dot recognition using Die Sort Manager controller software. Windows-based programming reportedly allows quick time to production.
Royce Instruments Inc., Napa, Calif.
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Flip Chip Underfill
Loctite 3568 is a reworkable capillary flow underfill formulated for use on polyimide and silicone nitride passivated flip chip, CSP, BGA and µBGA assemblies. The underfill allows flip chips to be replaced after testing determines that a chip is defective. The defective flip chip packages can be removed by heating the package and underfill for one minute at a temperature of 210 to 220°C. The epoxy-based liquid underfill cures in 5 to 15 minutes when exposed to 150 to 165°C temperatures, and can penetrate gaps as small as 1 mil.
Loctite Corp., Rocky Hill, Conn.
Wafer Probe
The DCP-HTR probe is designed to provide parametric capacitance measurements by minimizing position-dependent capacitance variation while reducing the need for frequent C meter nulling. The probe tip design complements the AttoGuard measurement shield, enabling device characterization with high signal integrity to the device-under-test. The probes use the same signal path accessories as the company's existing probe series.
Cascade Microtech, Beaverton, Ore.
3-D Package Analysis
The Turbo Package Analyzer (TPA) characterizes an entire package structure and automatically produces accurate resistance, inductance and capacitance) values. The analyzer is automated for ball grid array and flip chip package types, as well as chip scale packages and system-in-package components. The system also handles arbitrarily shaped power or ground structures, including solid or meshed planes. Its 3-D field solver uses a fast multipole method to analyze complicated packaging and interconnect structures efficiently.
Ansoft Signal Integrity, Pittsburgh, Pa.
Characterization Sub-System
The Laser Diode Characterization Sub-System is a versatile and modular platform used for die and COC testing of laser diodes. The system offers tools to build a laser characterization workstation so yield improvements may be realized earlier in the packaging process. This sub-system includes a precision motorized stage and motion controller needed for electrical probing of the devices as well as a vision system that comprises two sets of orthogonal video imaging systems used for guiding probes to specific locations. A computer and the company's Process Control System software also are included, offering complete multi-tasking control of motion, instrumentation, alignment, metrology and other test functions.
Newport Corp., Irvine, Calif.
Wafer Rotation
A wafer rotation system used during automatic die bonding features integrated vision with a mechanism for theta rotation of the wafer frame assembly to align the die with fixed ejector pins. As the system picks the die from the wafer tape, it vision processes the die and then rotates the wafer to align individual chips and ejector pins. This process is said to increase the number of die that can be used per wafer, resulting in higher yields.
MRSI, North Billerica, Mass.
In-line Plasma System
The XTRAK in-line plasma system is designed for fast, efficient surface activation and cleaning that can process a single substrate or carrier in less than one minute. With single-lane in- and out-feeds, the system is said to be available in a standalone configuration with integrated loaders. The system can be included in an island form-factor to feed a designated line of equipment, including component attach systems, wire bonders and dispense equipment.
March Plasma Systems, a subsidiary of Nordson Corp., Concord, Calif.
Wafer Feeder
New options have been added to the Wafer Feeder from Universal, including 300 mm wafer feeding and die inversion of bumped devices, enabling the feeding of flip chip devices directly from large wafers. The flip chip option allows processing of bumped devices directly from the wafer. The wafer feeder can process flip chip and bare die with the machine setup, enabling semiconductor manufacturers to run multiple processes on the same machine with minimal operator intervention.
Universal, Binghamtom, N.Y.