NEW PRODUCTS
12/01/2005
Metrology System
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The FRT MicroProf TTV (total thickness variation) tool is a non-contact metrology system for measuring absolute thickness variation on wafers and parts up to 300-mm diameter with a vertical resolution of 20 nm. Two vertically opposed chromatic sensors allow for measurement on most non-reflective and reflective surfaces. For thickness inspection before dicing, measurements can be made through such transmissive materials as dicing tapes. Fixtures support the parts or wafers only on the outer area. A high-resolution, fast, non-contact raster allows for such parameters as thickness, TTV, roughness, step heights, pitches, bumps, bow, warpage, and film thickness. Mark III software provides data analysis for 2- or 3-D images and data in various formats. FRT of America, Campbell, CA, www.frtofamerica.com.
LNA Module
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The ALM-1106 0.9- to 3.5-GHz monolithic microwave integrated circuit (MMIC) low-noise amplifier (LNA) incorporates a low noise figure to improve sensitivity, miniature size, low-voltage operation, and battery-saving features for GPS receivers in mobile phone handsets. A built-in shutdown function minimizes standby current. It is supplied in a leadless, 2 × 2-mm, low-profile (1.1-mm max) molded chip-on-board (MCOB) package. Performance features include a 0.85-dB noise figure; 14.8-dB gain; 0-dBm output power and 1-dB gain compression; and an input third-order intercept point of +5 dBm. The module operates over a 1.0- to 3.3-V range with an operating current (VDD) as low as 3.5 mA at 1 V, and a total shutdown current of approximately 120 µA total. A proprietary GaAs enhancement-mode pseudomorphic high-electron mobility transistor (E-pHEMT) process achieves high gain operation with low noise figures and high linearity. A CMOS-compatible shutdown pin can also provide variable bias to the amplifier. Agilent Technologies Inc., Palo Alto, CA, www.agilent.com.
SOIC Adapters
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The Series 665000 Correct-a-Chip adapters accept wide-body SOIC DW-package devices, while mounting on boards designed for narrow-body SOIC D-package footprints. Both designs are available in 8 through 24 pins, and are constructed of 1.56-mm FR-4 boards manufactured to IPC-600E Class 2 standards. The FR-4 material is glass-filled and UL94V-0-rated with 1 oz of copper traces. The male pins are brass with 200-µin tin over nickel plating. Aries Electronics Inc., Frenchtown, NJ, www.arieselec.com.
Data Matrix Decoder
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The ECC200 PIATI_XPL data matrix decoding system can operate in either area or line scan mode to read codes on wafers, PCBs, or substrates that have been laser-scribed, dot-peened/pin-stamped, ink-jet-printed, or electrochemically etched. PIATI_XPL identifies, matches, sorts, tracks, and verifies these products as they move through various manufacturing or material handling processes. Internal triggering capabilities, parallel image acquisition, and Direct Pixel Access acquire and analyze the minimum number of pixels required to decipher codes, enabling up to 125/sec decode rates on items moving at 12 m/sec. Components include a CMOS image sensor with 1024 × 1024 randomly addressable pixels; an embedded Digital Signal Processor; SRAM and Flash memory; RS-232 and RS-485 serial interfaces; and 8 digital I/O lines. The Value Engineering Alliance, Cambridge, MA, www.piati.com.
Next-generation Data Analysis Software
The latest generation of Streetwise Production and Streetwise Engineering tools adds support for multi-process flow analysis and multi-process flow bin map merge capabilities to its catalog of product functions. Streetwise is designed to identify outliers already designated as passing devices, but exhibit electrical characteristics that are slightly different from other devices on the wafer. Identifying anomalies within the passing devices population allows the manufacturer to bin them separately, thereby improving the ratio of defective parts per million. A “recipe-driven” approach allows the customer to configure analysis and binning strategies to specifically address the needs of a given process, product, and/or quality policy. Streetwise solutions offer an easy-to-use, fully automated production operation, ensuring that 100% of the data is analyzed 100% of the time in a 24 × 7 production environment. Streetwise products are offered in a variety of license configurations to fit any company’s specific goals. Test Advantage, Tempe, AZ, www.testadvantage.com.
Die Attach Adhesive
AAA1002A self-filleting die attach adhesive exhibits capillary flow during a programmed temperature ramp-up. It achieves 100% area coverage under the die without producing a bulky fillet that can overflow onto the top of thin die before it reaches the cure-onset temperature. After AAA1002A is dispensed into an “X” pattern, the die is lowered to a height at which the pattern spreads, but does not reach the edge of the die. Once the part is subject to the standard ramp-up cure process, the material flows, covers the entire die area, and forms a continuous fillet on all four edges. It bonds to various organic and ceramic substrates; can spot-cure on a heated indexer; can snap-cure in a multi-zone oven; or be batch-processed in a box oven. A low-bleed, Teflon-filled, non-conductive paste for tight-tolerance, single die attach, and die-stacking applications, it achieves low-bleed property without sacrificing the properties of the X-BMI resin that passes JEDEC moisture-level testing and 260°C reflow. Advanced Applied Adhesives, San Diego, CA, www.advancedadhesives.com.