New Products
05/01/2005
Die Sorter
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Easyline 8031T sorts onto carrier or surf tapes for wafer-level packaging, chip-on-board, and flip-chip-on-board. Processors, power LEDs, power diodes, and other devices for processing on surface mount machines can be sorted into different bin code qualities with the wafer-mapping option. An integrated post-placement inspection and bad die remover ensures that the specified number of dice per lot is processed. Dice can be placed either directly onto a tape or flipped in the die flipper. A mouse click facilitates changeover between flip/non-flip processes. Based upon a high-speed, air-bearing, die pick-and-place system, it provides placement accuracy and productivity in the 150- and 200-mm markets. A closed-loop, linear-motor pick head provides synchronous die ejection without any needle marks on the die backside. An EIA 481-compliant tape feeder with constant pressure sealing aligns the tape smoothly at placement position. Front access to all major systems simplifies operation with a 1-m2 footprint. Alphasem AG, Berg, Switzerland, www.alphasem.com.
Viscosity Management
Viscosity Control System provides continuous viscosity management to maintain consistent delivery of temperature-responsive conformal coating fluids. A heated, recirculating fluid circuit with close-range temperature monitoring keeps the coating process consistent and stable. Solvent usage may be reduced, resulting in less VOC emissions. An option for the company’s Century Series Conformal Coating platform, fluid delivery is monitored closely and maintained at set parameters. When loading a batch of fluid in a coating system, the system brings the fluid up to optimal coating temperature. Fluid is recirculated past strategically located temperature probes that control the temperature to within 1ºC. Safety is designed into the system by using components that meet the most stringent standards for use around volatile materials. Asymtek, Carlsbad, Calif., www.asymtek.com.
3-D X-ray
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ClearVue 3-D X-ray imaging technology detects PCB solder and production defects by using its patented off-center tomosynthesis imaging method, making it ideal for densely packed single- or double-sided boards that use BGA-style components, and for problematic loss of electrical or optical access. ClearVue operates using a stationary x-ray source and detector, and does not require complex or rotating mechanical parts, resulting in lower false call rates and improved reliability, repeatability, and cycle times. Teradyne Inc., North Reading, Mass., www.teradyne.com.
Test Platform
The SiPFLOW test platform integrates a small footprint, low power consumption, high-bandwidth operation via a wide bus interface, and the SiPLINK testing architecture. The 166-MHz IT16M32SD and the 100-MHz IT16M32SDL I.P. products are high-speed and low-power (1.8V CMOS), DRAM designs. Both designs incorporate this company’s design-for-test technology using voltage-induced burn-in emulation technology. The SiPFLOW platform provides a cost-effective and reliable methodology for SiP optimized solutions in multimedia cell phones, consumer audio/video portables, digital displays, and micro-hard-drive storage devices. Inapac Technology Inc., San Jose, Calif., www.inapac.com.
Ball Bonder
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Maxum ultra ball bonder can process stacked die, multi-tier, low-k, ultra-fine-pitch, long- and low-loop shapes, and other complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond-head velocities, without increasing tool impact force. Its microprocessor control system provides fast processing power and PC-style USB functionality, facilitating software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds. Accuracy is ±2.5 µm for 35-µm-pitch production. Kulicke & Soffa Industries Inc., Willow Grove, Pa., www.kns.com.
Transceiver IC
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The AMIS-42665’s high-speed, single-chip transceiver combines operation to 1 Mbaud with a low-current standby mode and a bus-initiated wake-up capability. Suitable for 12- and 24-V automotive applications, the transceiver is fully ISO 11898-2- and ISO 11898-5- compliant. High tolerance to EMI and an ESD rat-ing of ±8 kV eliminates the need for additional filtering and protection. Remote wake-up can be initiated either locally or via the CAN bus, depending on specific application requirements. The device integrates into a miniature, “green” SOIC 150-8 package to provide an interface between a CAN controller and a physical bus. AMI Semiconductor, Pocatello, Idaho, www.amis.com.
- Lee Mather