Coming Soon in 3D
09/01/2007
Ultratech, San Jose, CA
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![]() 3. Donnelly, Flower, and von Trapp model the latest in cleanroom fashion - color-coded to differentiate visitors from staff engineers. |
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![]() 4. The tools are modular, broken down to the front-end module, the stepper, and the electronics module. |
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![]() 6. The back-end of the machine houses the electronics. |
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![]() 7. Mahany describes the stage area as housing the sensitive parts of the mechanism. |
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Synova, Fremont, CA
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![]() 3. Greenberg explains how an LED illuminates the workpiece by penetrating through the waterjet and reflecting off the series of mirrors. |
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![]() 4. Greenberg shows us an actual coupling unit to further illustrate his diagram. |
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![]() 5. Kling shows Flower and von Trapp the precision cuts LMJ can perform for medical applications. |
![]() 6. Sample wafer shows how laser dicing does not have to occur in straight lines, and different-size die can be cut from the same wafer. |
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Rogers Corporation, Rogers, CT
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![]() 3. John Reynolds, senior engineering assistant, explains how he uses an Agilent network analyzer to characterize electrical properties. |
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![]() 4. Murali Sethumadhaven, Ph.D, group leader for new business development, talks about Rogers’ non-silicone, zero-contact-resistance TIM, recently licensed from IBM. |
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![]() 5. Amie Tworzydlo, engineering assistant, calculates thermal resistance and conductivity of the company’s non-silicone thermal grease using an Analysis Tech TIM tester. |
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