All That Glitters
08/01/2007
Semiconductor Packaging Materials, Armonk, NY
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![]() 2. Lester Williams, assistant manager, rolling/cladding department, demonstrates the process of cladding copper strip with aluminum. |
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![]() 3. SPM custom fabricates tools for stamping precise and uniform parts, and has over 4,500 different die designed to customer specifications. |
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![]() 4. Solder preforms, braze alloy preforms, bond pads, clad material substrates, and heatsinks are just some of the stamped parts manufactured by SPM. |
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![]() 6. Heavy-gauge aluminum wire is pulled through a mill, annealed, and spooled to create aluminum ribbon used for ribbon bonds on high-power packages. |
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![]() 7. A spool of fine gold wire goes through an optical inspection before shipping to the customer. |
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![]() 2. Ron Bacon, QC technician, prints paste for analysis. |
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![]() 3. Krupali Patel, chemist, uses infrared spectroscopy to measure inorganic compounds through substantive analysis. |
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![]() 4. Lathrop explains the Benchmarker II test board for testing lead-free performance of various materials in different applications. |
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![]() 5. Lathrop designed a special nozzle adaptation for a pick-and-place tool to handle miniscule copper preforms. |
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![]() 6. This environmental control unit (ECU) allows Lathrop to test materials in different environments. |
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![]() 7. Lathrop explains coplanarity to von Trapp, against the backdrop of the May 2005 Advanced Packaging cover, featuring a wafer bump stencil he designed. |
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![]() 2. Jon Brunner, senior process engineer, demonstrated wire bonders in the applications lab, showing us how the Ultra forms ball to wedge and stitch bonds. |
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![]() 3. Virginia Motta, metrology technician, uses a Dage cold pull tester to measure the amount of pressure it takes to shear the ball off the bond pad. |
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![]() 4. Wafer-level stud bumping for flip chip uses the same technology as forming the first bond of gold ball bonding. This tool can create 36 standard bumps/sec. |
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![]() 5. Zhijie Wang, Peter Lister, Paul Sucro, Gordon Tang, vision software engineers, are working on the next-generation tool. |
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![]() 6. Horst Clauberg, Ph.D., senior scientist, demonstrates how he uses a scanning electron microscope (SEM) to check ball placement position on a bond pad. |
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![]() 7. Courtemanche, von Trapp, and Donnelly share a Kodak moment with Scott Kulicke, chairman of the board and CEO, Kulicke & Soffa. |
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