In the News
08/01/2007
Panasonic Opens Advanced Packaging Lab
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BUFFALO GROVE, IL - Panasonic Factory Solutions Company of Americas (PFSA) opened an advanced packaging laboratory to develop process solutions in a “true-to-life” environment. The lab is one of four - others are located in Japan, Germany, and Singapore - that Panasonic Factory Solutions uses for material qualifications in substrates and surface finishes. Gene Dunn, PFSA engineering manager, microelectronics, oversees the lab. The location hosts underfill dispensing systems, plasma cleaners, bonders, chip shooters, and curing ovens, along with other package and SMT assembly equipment. Scanning electron microscopes (SEMs), X-ray inspection systems, C-mode scanning acoustic microscopes (C-SAMs), and other tools perform package analysis.
Vermont Students Visit SUSS
WATERBURY, VT - Early this summer, with school out, students from Stowe High School, Stowe, VT, listened intently as Sumant Sood, application engineer, SUSS MicroTec, explained the many reasons for pursuing a career in microelectronics. “Why work in electronics?” he asks. Students point out the excitement of the unknown and invention, the satisfaction of improving lives, and - of course - the fun of playing with next-generation cool gadgets for a living.
The tour included the product and machine design and research centers, manufacturing, applications, software, and other groups at SUSS’ Waterbury, VT, facility.
SEMICON West Attendees Choose 2007 ACA Winners
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