Issue



In the Wild, Wild West


05/01/2007








1. It was 90° and sunny at the Amkor campus in Chandler, AZ. We took advantage of it for the group picture. (L-R) Barry Miles, senior VP, CSP, BGA and module products; Tim Olson, senior VP, leadframe; Oleg Khaykin, executive VP, COO; Jeff Luth, VP, corporate communications; Gail Flowe, editor-in-chief; Chris Platt, group publisher; Françoise von Trapp, managing editor.
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2. Kent Carrie displays a cantilever probe card from MicroProbe for wafer-testing RF applications.
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3. Flower; von Trapp; and Diane Donnelly, national sales manager, Advanced Packaging, look on as Carrie explains Credence's 8-inch prober. Needles make electrical contact with pads on the silicon. The test head flips the wafer over to meet with the pogo pins on the tester. The machine can accommodate both cantilever and vertical probe cards.
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4. This Seiko Epson handler picks up the part to be tested from the input tray and sockets it into the test contactor. Once socketed, the tester takes control and electrically tests the device for functionality. The tester then gives a bin signal to the handler, where it automatically sorts the tested units into good and bad trays.
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5. Scott Krupa, senior mixed-signal test engineer, is seen here working on the Verigy 93k tester.
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6. Krupa and Nick Ellis senior RF test engineer, collaborate on the challenges associated with quad-site RF testing.
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1. Flower; Charlotte Frederick, HyperFlo president; and Jack Mulligan, CFO, pose with the base unit of a Hyperflo ENV 1500 featuring a Class 100 clean-room-rated process module with cylindrical vacuum chamber.
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2. Frederick and Mulligan showed us the inner workings of Hyperflo’s closed-loop technology. This part of the system can be kept outside the clean room, allowing the chamber to occupy a smaller footprint inside the clean room.
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3. Mulligan poses with a HyperFlo ENV 3000 batch cleaning system designed to run aqueous and semi-aqueous chemistries.
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4. Figure 4 features a cylindrical chamber with optional viewport lid.
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5. while Figure 5 shows an example of a rectangular chamber. Tanks can be made in different shapes and sizes because, under vacuum, all surfaces see equal pressure no matter what the size of the chamber.
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6. In Frederick's R&D corner of the clean room, von Trapp; Steven Krsna, staff engineer; Frederick; and Flower shield top-secret research.
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1. We had our largest Roadshow roundup yet. Many of these Antares employees came to town for the BiTS workshop and Antares annual sales meetings.
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2. Oded Lendner, COO and president for the package test business unit, joined in the discussions, noting that the socket market is so fragmented that providing customers with turnkey solutions allows them to integrate the technology and test components in-house.
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3. 4. Samples of Quatrix, a photo-lithography system for testing ICs that replaces pogo pins with plate- and etch-formed contact interface points.
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5. Al Santos, manufacturing engineering technician, demonstrates how this retrofitted wire-bonding equipment creates Quatrix test socket interface points that replace traditional pogo-pin technology.
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6. IIa Pal, product development engineer; and Mark Murdza, director of marketing, display a DUT board device simulator for testing the lifeline of sockets and components.
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7. Antares manufactures its own prototype test sockets on CNC machines like the one shown here.
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8. It takes 3.5 hours to get a piece of Victrex PEEK, a ceramic and polymer insulating compound, machined from a solid block (left) to the 5-mm-pitch, 1300-holed test socket (right).
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