Welcome to Nerdvana!
04/01/2007
Vectron International, Hudson, NH
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![]() Suited up for the class 100 cleanroom, it’s hard to tell who is who. (L to R) Collopy, Courtemanche, von Trapp, Donnelly, Flower, and Li. |
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![]() The masks are transferred to the evaporator for metal deposition using shadow masking technique. |
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![]() The Docksis Module is a surface mountable, two-sided, FR-4 based package that integrates more functionality into transmitting telephone data. |
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![]() Viscosity sensors have a scratch-resistant diamond coating and a quartz sensor transducer on one side, and proprietary coatings on the backside in a gold leadframe package. |
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![]() The JPSA founding triad: Patrick Sercel, Jeffrey Sercel, and Randy Hill gave us a tour of the demo lab where final test and evaluation is done. |
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![]() JPSA’s sub-assemblies are modular, allowing systems - regardless if they are diode pump solid state (DPSS) or eximer - to be built faster at lower cost. |
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![]() The eximer laser system is suited for lithographic patterning of sensors because it exposes a larger area. It features selective material removal using photo-ablasion. |
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![]() Sercel demonstrates the safety feature on the JPSA system cabinet. When the door is open, the system shuts down, to eliminate risk of “welder’s burn.” |
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![]() Daniel Lobdell, applications engineer, demonstrates how a wafer is mounted on a carrier frame. Lobdell also demonstrated the wafer dicing process on a Disco saw. |
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![]() After reflow, rinsing with deionized water in the ACCEL Microcel system removes flux residue |
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![]() This Universal Advantis was used to pick-and-place the flip chip, as well as dip it in Multicore tacky flux. |
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![]() At the wire bond station, Jeremy Alonte, applications engineer, is checking for bleed out of materials over the wire bond and checking the integrity of the bond. |
![]() Next, the flip chip is underfilled with Hysol FP4581 using an Asymtek system fitted with and auger pump dispense head. |
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