APEX PRODUCT PREVIEW
01/01/2007
CT Option
A computerized tomography (CT) capability, XXX, generates a 3-D image of an object from a series of 2-D images captured on a single axis of rotation. Suited to stacked die, MEMS, package-in-package (PiP), and package-on-package (PoP) inspection, the CT option installs without mechanical or electronic modifications to the system. Analytical abilities are enhanced by sectioning out high-resolution “slices” of any part of the complete image. XXX will be optional on all YTX-3000 systems, and the 3-D imaging capability will become part of all high-resolution models. YESTech, San Clemente, CA, www.yestechinc.com. Visit YESTech at Booth 1407.
Dispensing Jet
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The SC-400 PreciseCoat conformal coating jet selectively applies materials onto small substrates or in tight tolerances. Using a needle design with non-contact jetting and pulse-width modulated control, the product delivers conformal coating in small volumes at widths down to 1.2 mm, and thicknesses of 15 µm with solvent-based materials. One applicator delivers multiple dot sizes for small sections and an available dual-valve configuration covers large areas. Asymtek, Carlsbad, CA, www.asymtek.com. Visit Asymtek at Booth 3037.
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Flying Probe Tester
AERIAL is based on the core hardware and software of the VIVA integrated platform (VIP) and uses four independent, mobile test probes to test both sides of a board. It suits prototypes, samples, small-, and medium-sized series due to flexibility during board development. The machine has a vertical, compact structure for ease when loading and testing larger boards; a clamping system eliminates vibration and oscillation during test. AERIAL uses a proprietary one touch per net (OTPN) technique in which multi-tone signals are injected through the nets of the unit-under-test (UUT) and fast fourier transforms (FFTs) analyze results to characterize the net and identify faults on subsequent boards to be tested. Verification of junction faults and other tests are run at the same time. Options include in-circuit test (ICT) and visual inspection software modules. The system operates with data collection and statistics functions. Seica, S.p.A., Strambino, Italy, www.seica.com. Visit Seica at Booth 2101.
Stencil Cleaner
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The Cyclone precision cleaning technology suits advanced stencils with rapid cassette-based paper changeover in less than 20 seconds. The cleaning system provides bi-directional active cleaning; lateral oscillating action occurs simultaneously with traverse. The technology’s five-stage cleaning head provides progressive cleaning, combining a single wet oscillating stroke with five leading edges to dislodge and remove remaining solder paste residue from the stencil apertures. This process is followed by a return high-flow vacuum stroke using four vacuum vents. DEK, Flemington, NJ, www.dek.com. Visit DEK at Booth 2047.
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Underfill
Loctite 3536 underfill is said to improve reliability in advanced CSP and BGA packages. The material is designed to quickly fill the space beneath packages and cures rapidly at low temperature to minimize thermal stress to other components on the PCB. In-line curing increases throughput. When fully cured, the product protects solder joints against mechanical stress such as shock, drop, and vibration in hand-held devices, especially with lead-free solders. The electronics group of Henkel, Irvine, CA, www.henkel.com. Visit Henkel at Booth 2001.
Dummy Components
Dummy components for Amkor Technology’s package-on-package (PoP) stacked daisychain, a PC200 PoP test board and kit, and other packages and print-test boards and kits will be available. Mechanical samples for Amkor and components from most other surface mount device (SMD) manufacturers, as well as solder-training kits and PCB-training and test boards, offer various testing options for designers and manufacturers. Practical Components Inc., Los Alamitos, CA, www.practicalcomponents.com. Visit Practical Components at Booth 2565.
Chip Shooter
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The sixth-generation KE-2070 is a high-speed, modular chip shooter built on a one-piece SuperCast single-casting base. It uses a LNC-60 high-resolution laser centering system with magnascale resolution down to 1 μm. It facilitates placement of 33.5- × 33.5-mm to 01005 components. Designed with six nozzles to reduce change times, the head reaches 16,000 cph; automatic nozzle detection verifies proper usage. The machine incorporates stepper motors in the conveyor system and fiber-optic motion control communications. The shooter is compatible with existing Juki feeders, trolleys, and software. A multi-nozzle vision centering system (MNVC) is optional. Juki Automation, Morrisville, NC, www.jas-smt.com. Visit Juki at Booth 2437.
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Automated Optical Inspection and Defect Prevention
The Medalist SP50 Series 3 SPI system reportedly provides speed, accuracy, and repeatability with form factors as small as 01005. Proprietary imaging techniques and inspection algorithms offer statistical process control (SPC) and charting for operators, technicians, and engineers on paste, pre- and post-reflow trends, defect analysis, and defect prevention. A separate in-circuit test (ICT) system offers ease-of-use for in-production ICT. Advanced algorithms provide analog test with improved throughput. Simple graphical user interfaces are designed for clarity in high-volume manufacturing environments. A next-generation vectorless test innovation also is said to help manufacturers overcome test-access problems. Agilent Technologies, Santa Clara, CA, www.agilent.com. Visit Agilent at Booth 2213.
Device Programmer
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The desktop, automated Helix programming system comes standard with two tray input and output handling systems with a reject location. It uses the same core programming technology and socket modules as standard BPM automated lines, with interchangeable pressure plates. The system uses two seventh-generation programming sites with FX4 socket-module capability. It handles MSOP, SOIC, PLCC, SSOP and TSSOP, and other packages. Integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. Overall throughput reaches 800 devices per hour. One computer and software interface controls both BPWin software and operations. BPM Microsystems, Houston, TX, www.bpmmicro.com. Visit BPM at Booth 2223.
Wire Bonders
The HB16 and HB05 wire bonders perform wedge and ball bonding in one benchtop system. The machines target small production, prototyping, and R&D environments. The HB16 semiautomatic bonder incorporates motorized Y and Z travel to control loop shape with high repeatability. The system features manual, step, and semi-automatic bonding modes as well as stitch and bump bonding. The HB05 is a flexible, manual bonder featuring bump bonding for 17- to 50-μm wire and 25- × 200-μm ribbon. It offers independent control of first- and second-bond parameters. Both models offer deep-access bonding (16 mm) using a long-reach transducer. FINETECH, Berlin, Germany, www.finetechusa.com. Visit FINETECH at Booth 2715.
AXI Capability
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Automated X-ray inspection (AXI) capability, introduced on the COUGAR PRO X-ray inspection system, identifies process errors and error trends based on product inspection, and allows the operator to correct the causes. AXI suits inspection of BGAs and hidden solder connections in PCB assemblies. The COUGAR PRO is a modular design that can be configured as a stand-alone system with automatic analysis, as an off-line automatic handling and analysis system, or as an in-line automated X-ray system. A standard five-axis manipulator controls samples under inspection. BGA, QFP, solder attach, and barrel fill operators, or the COGNEX programmable automated defect recognition (ADR) module, perform specific inspections. Results are displayed on-screen or in statistical process control (SPC) data format, with HDX-Ray 16-bit imaging chain and true X-ray intensity (TXI) control. COMET, Garbsen, Germany, www.comet.ch. Visit COMET at Booth 2611.