Who’s Who at BiTS, SEMICON China and IMAPS Device Packaging Symposium
05/01/2008
The Advanced Packaging editors covered a lot of ground this spring as co-sponsors of the Burn-in and Test Socket (BiTS) Workshop in Mesa, AZ, attending SEMICON China in Shanghai, and the IMAPS Device Packaging Symposium in Scottsdale, AZ. As a result, we got to talk to industry movers and shakers, and see and learn what everybody’s been up to in those R&D labs since last year.
BiTS Workshop, Mesa AZ
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Fred Taber, general chair, BiTS Workshop; keynot speaker, Belgacem Haba, CTO of Advanced Packaging and Interconnect, Tessera Inc.; and Gail Flower, editor-in-chief, get caught up at the opening reception.
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Terence Collier, president, CV Inc., and Advanced Packaging contributing editor, gives his attention to the speaker while waiting to present his paper titled ”Improved Method for Socket Evaluation, Development and Cleaning“.
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Che-Yu Li, consultant and Joe Fjelstad, Advanced Packaging advisory board member, consultant and developer of the much talked about Occam Process, compare notes and exchange information.
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Kena Pegram, V.P, Anestel Corporation, showcases the company’s specialty products to suit the variety of packages in the market today.
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Takuto Yoshida poses with his poster presentation, which outlines how prober equipment can enable a coaxial BGA test socket to become a probe card for 3-mm, 4-mm, and 5-mm pitch WLCSPs.
SEMICON China, Shanghai
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A constant stream of visitors flowed in to SEMICON China, held in the Shanghai New International Expo Centre, to attend grand new product introductions and educational forums that addressed the latest in growth areas for electronics.
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Flower, Barbara Goode, editor-in-chief, Small Times magazine, and Christian Rheault, senior V.P, equipment, for Kulicke & Soffa, discuss the company’s 2 next-generation wire bonders, launched just after SEMICON China opened for public viewing.
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Rao Tummala, Ph.D., founding director of Georgia Tech Microsystems Packaging Research Center (PRC); Peter Sexton, Ph.D.; business development manager, Technic Inc., and Lee Smith, senior director of business development, Amkor, visit during the symposium welcome reception.
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At ASM Pacific Technology’s booth, Flower gets a look at the company’s Osprey 40T, an automolding machine for high product mix and low-volume manufacturing.
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The team from SUSS MicroTec welcomed Q3D in grand style ??? minus the silicon tiara. Maybe at SEMICON West? We’ll see. (L-R) Sumant Sood, application engineer, Wilfried Bair, VP, strategic business development; Fran??oise von Trapp, managing editor, Advanced Packaging, Brian Folmer, sales manager, and Keith Cooper, business development manager.
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Booth attendants prepare promotional posters for distribution at the SMT China booth, which graciously shared the stage with sister publication, Advanced Packaging.
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At the Enplas booth, Flower got another lesson in test and burn-in socket devices, in addition to what she had learned at BITS.
IMAPS International Device Packaging Symposium, Scottsdale, AZ
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Karl White, and Carl Mann, sales managers, handled EV Group’s booth traffic, demonstrating the company’s temporary wafer bonding system with panache, while Thorsten Mathias (not shown) was kept busy as co-author of two presentations on 3D integration processes, and presenter of one, and co-chair of the Thursday session.
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Bradley Benton, national sales manager for Palomar Technologies, gave an update on the activities of its subsidiary, Palomar Microelectronics assembly services. The company has tripled its cleanroom space to accommodate growing demand for services.
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Jerry Muenchow, western regional sales manager, represented Orthodyne Electronics. The company specializes in power ribbon bonding and alternate wire materials for power and custom hybrids, automotive electronics, power semiconductors, and fine-pitch and sensor applications.
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Thorsten Teutsch, Ph.D., president, PacTech USA updated Advanced Packaging about the company’s developments in solder ball transfer technology to fill a missing niche high-end flip chip devices and WLCSPs.