New Product Showcase
04/01/2008
PRODUCT FOCUS - INTERCONNECT MATERIALS
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Dry Film Photoresist
WBR 2000 Series dry film photoresist material from DuPont Advanced Packaging Lithography, was developed for advanced semiconductor packaging applications, including electroplated solder, photostencil and copper pillar bumping. Unlike liquid resists, these dry film photoresists do not require drying of solvents and can be applied in a single uniform layer across the entire wafer with no edge bead. These properties enable higher productivity and yields, particularly for manufacturers requiring thicker layers, which are reportedly difficult to produce with liquid resists. The WBR 2000 Series is said to deliver improved resolution, speed, and consistent resist thickness across the wafer, as well as simpler processing and a reduced environmental footprint. Due to its high heat resistance, chemical compatibility, and easy removal, WBR 2000 is suited for multi-purpose use, including in-via and mushroom plating, photo-stenciling and copper pillar metallization. Films are available in 50, 75, 100 and 120-μm thicknesses. DuPont Electronic Technologies, Research Triangle Park, NC www.advpackaging.dupont.com
Materials for Wafer Bumping Applications
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Umicore EPM introduces Microbond Docfish, a product family of wafer bumping materials that includes solder paste, tacky flux and solder spheres. UltrafinePitch paste reportedly demonstrates uniform printing behavior with tight coplanarity. It is available in solvent clean (no clean) and water soluble series. All standard lead-free alloys are available with standard solder powder particle size of type 5, 6, and 7.
Designed to be used in all standard reflow soldering systems, the tacky flux series is adjustable for a variety of customer processes with different activation grades. Available in solvent clean (no-clean) and water-soluble series, it is suitable for printing, dipping, spraying or jetting applications.
Aurora Solder Spheres are microspheres from Duksan Hi-Metal (standard diameter range from 300 μm – 70 μm) fabricated from sophisticated, recently developed, alloys for reportedly excellent drop test and thermal cycling results. All standard lead-free alloys are available. Umicore EPM, Hanau, Germany www.microbond.eu
CSP/BGA Underfill
Hysol FP6200 is a CSP/BGA underfill designed to improve thermal cycling reliability. The material is reworkable, allowing for additional process window and recovery of high-cost substrates and PWBs. The removal procedure for FP6200 involves heating the underfill to approximately 240??C using a hot air nozzle on standard BGA rework equipment. The component is then twisted and removed. Residue removal is accomplished using a tacky flux or liquid flux and a solder removal vacuum tool.
FP6200 is a fast-cure black epoxy material. Cure rate depends on the mass of material to be heated and intimate contact with the heat source. Electronics Group of Henkel, Irvine, CA. www.henkel.com
AlSiC Heat Spreader Flip Chip Lids
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System-in-package (SiP) technology combines multiple die with multiple functionalities into a single package. CPS Technologies Corp. AlSiCs metal matrix composite lids provide a packaging solution for SiP and flip chips.
Thermal management with device-compatible coefficient of thermal expansion (CTE) reduces stresses due to differential CTE of device and assembled materials. AlSiC material’s high thermal conductivity value offers efficient thermal dissipation. Together, these properties improve reliability in flip chip approaches by reducing assembly bowing and flexing that can lead to delamination, solder ball, or die failure.
AlSiC is a lightweight material that reduces the weight per solder ball, improving assembly yield and a product’s in-service vibration tolerance. It also allows for less restrictive orientation requirements for larger lid structures. Larger lid packaging is possible due to the higher stiffness and lower density of AlSiC.
The CPS AlSiC net-shape casting fabrication process produces both the composite material and product shape in one process step for improved geometrical capability. It also enables functional design features, such as pockets for memory chips, capacitors, resistors and cavities or pedestals for the die. Depth of these features is tightly controlled to minimize the thickness of the bond length and assembly, as well as the thermal dissipation variability between assemblies. CPS Technologies, Norton MA www.alsics.com
X-ray Inspection
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X-Tek has added a Quad View facility and dual LCD monitors to the Revolution system to enhance its viewing capabilities and user-friendly appeal. It allows 4 images to be displayed at once. The LCD monitors provide a means to separate X-ray images from the software control to enable clutter free viewing.
The ability to detect defects from X-ray images using the enhanced viewing capabilities is supported by the Revolution’s magnification and imaging technologies. The Revolution provides up to 13000?? system magnification at all angles over the entire 400 ?? 400 mm manipulator scan area. Additionally, it is capable of feature recognition to approximately 500 nM.
The system’s photography equipment incorporates a dual field image intensifier with a digital camera. The production of high resolution images is supported by Inspect-X, an advanced image capture and analysis software with special functions for inspection of semi-conductor package voids, wire bonding, and BGA solder bumps. A small footprint and high resolution and magnification within a compact system make the Revolution suitable for quality control, research and failure analysis. Xtek Group, Tring, Herts, UK.www.xtekxray.com
Multi-sensor Measuring System
The iNEXIV VMA-2520 from Nikon is a light weight, compact multi-sensor measuring system designed to measure 3D workpieces in a variety of industrial measuring, inspection, and quality control applications. Its 200 mm Z axis measuring range, together with an optical system featuring a long 73.5 mm working distance enables easy measurements of electronic components and medical devices. Touch-probe ready, it integrates the latest imaging processing software and incorporates a new 10x optical zoom system and Laser Auto Focus option.
To further enhance its advanced measuring capabilities, the iNEXIV has integrated image processing software to make the system a powerful photo documentation tool. The software also generates accurate 2D stitched panoramic images captured with CNC XY stage precision, making super wide field-of-view (FOV) observation possible.
A 10X optical zoom system has an ultra low distortion of less than 0.1%, and features an apochromatic objective lens with a high numerical aperture (NA 0.11) designed for maximum resolution and color correction performance. This bench-top system is fully automatic with high-accuracy features. Nikon Instruments Inc. Melville, NY www.nikonusa.com
Automated Optical Inspection
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Landrex Technologies, Inc. has added a high-resolution, four megapixel capability to its Optima 7250 systems. The Optima 7250 offers in-process measurement and defect detection for Wireless, RF, and NPI applications. The camera capability was developed specifically for demanding mcroelectronics applications and allows inspection of the smallest devices, like 01005 parts, for presence, correct value, placement accuracy, and orientation. It also features built-in compensation for normal PCBA and process variation during program and runtime. Landrex Technologies, Santa Clara, CA www.landrex-us.com