University cleanroom gains chip-scale technology
10/01/2005
FAIRBANKS, Alaska - The Office of Electronic Miniaturization at the University of Alaska Fairbanks (www.silicontundra.org) has partnered with Tessera Technologies (www.tessera.com) to use the company’s MicroBGA chip-scale packaging (CSP) technology for developing regional enterprise and government projects requiring reliable, industry-proven semiconductor packaging capabilities.
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The technology will be part of the university’s world-class cleanroom facility located within the 123,000-square-foot Natural Sciences Facility. The Office of Electronic Miniaturization cleanroom is the only one of its kind in Alaska. It was designed as a Class 10,000 [ISO Class 7] facility but is currently operating at Class 10 [ISO Class 4]. The cleanroom provides a sustainable prototyping and low-volume capacity for miniaturizing electronic components as well as component systems for academic, government and commercial needs.
 The Office of Electronic Miniaturization cleanroom was designed as a Class 10,000 [ISO Class 7] facility but is currently operating at Class 10 [ISO Class 4]. |
Leveraging the Tessera technology, university engineering students and faculty will be able to provide packaging and assembly services for a variety of semiconductor devices used in defense, medical, wireless, consumer and computer electronics. Office of Electronic Miniaturization Director Pramod Karulkar says the university “can help grow new technology companies and offer students and faculty access to semiconductor packaging technology that can bring their products from concept to reality.”
Karulkar says future technology plans include multi-die stacking and advanced packaging techniques.