Table of Contents
Solid State Technology
Year 2010 Issue 5
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Editorial Understanding Nanotechnology Safety
Pete Singer, Editor-in-Chief
Industry Forum Refurbished equipment: heating up and coming of age
Leading-edge fabs can stay competitive and productive with equipment strategies that reduce capital expenditures and increase profitability by comparing the advantages of buying new equipment vs. refurbished. Byron Exarcos, ClassOne Equipment Inc., Atlanta, GA USA
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DEPARTMENTS
World News.html World News
Technology News Applied's new InVia lays it on thick for 3D IC packaging
Technology News Inside the SOI Consortium's IP program
Technology News Mentor Graphics unveils IC package thermal characterization and design tool
Technology News SII, IME develop Si-based resonator, WLP tech
Product News.html Product News
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FEATURES
Cover Article Low-k damage reduction using a modified plasma strip process
A new strip method has been developed to simultaneously remove post-etch polymer while minimizing damage to the low-k film, thus enabling the integration of ULK films into advanced dual damascene structures. Rajesh Mani, Bing Ji, Steve Sirard, Andrew Bailey, Lam Research Corp., Fremont, CA, USA
Copper Interconnects Copper electroplating approaches for 16nm technology
Although additive and current waveform effect dominate fill capability, characteristics of the electroplating bath such as temperature, ionic concentrations, and corrosion potential must also be optimized for 16nm performance. Jonathan Reid, Andrew, McKerrow, Sesha Varadarajan, and Greg Kozlowski, Novellus Systems, Inc., San Jose, CA USA
Pop _package On Package Improving package-on-package reliability: a multi-material approach
Incorporating proven, high reliability materials at all layers of the device — from the package level to the board level — will go a long way toward advancing electronics technology, especially for the handheld sector. Mark Currie, Henkel Corporation, Irvine, CA USA
Test Sockets_and_probe System integration is key to optimum test cell performance
There are many areas within a test system in which a more integrated approach can improve performance and reduce cost. Gerhard Gschwendtberger, Multitest elektronische Systeme GmbH, Rosenheim, Germany
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