Table of Contents
Solid State Technology
Year 2010
Issue 2
 | COLUMNS
Editorial
Industry Restructuring in Progress: The Haves and Have-Nots
Pete Singer, Editor-in-Chief
Industry Forum
Recession as the mother of innovation
As the industry moves out of the recession, continued innovation investment is the proper path—necessity may be the mother of invention, but perhaps recession is the mother of innovation. Michael Todd, Henkel Corporation, Irvine, CA USA
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DEPARTMENTS
World News.html
World News
Tech News
ISS: Major consolidation concerns as R&D rift deepens
Tech News
New GaN MOCVD tool for high-volume HB-LED
Tech News
Allvia shows off its Si interposer data
Product News.html
Product News
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FEATURES
Cover Article
Temporary bonding enables new processes requiring ultra-thin wafers
A system is described that supports a wafer during backgrinding and subsequent post-thinning processes used in 3D integration. Richard Webb, 3M, Maplewood, MN USA
Package Inspection
Automated inspection improves yield, reduces manufacturing cost of 3DICs
Standards and best practices for automated inspection for the next generation 3DIC and TSV processes are being developed at Sematch's WtW 3D interconnect line. Rudolph Technologies, Inc., Bloomington, MN USA
Next Gen Lithography
Lithography perspective for the 22nm half-pitch
Progress has been made on double-patterning lithography as well as EUVL. Chip manufacturers must now decide which technology to use based on its availability and cost, and requirements of their product roadmap. stefan Wurm, Sematech, Albany, NY USA
Strain Engineering
Modeling of stress and narrow-width effects in shallow trench isolation
Shallow trench isolation (STI) effects cam be accurately simulated with TCAD, allowing technologists to optimize the process to account for and mitigate the impact of these effects in CMOS technologies. Ricardo Borges, Synopsys, Mountain View, CA USA
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