Issue

The American Recovery and Reinvestment Act (HR 1), which was signed into law on February 17th by President Obama, includes more than $15 billion for vital scientific research programs.

Experts say we’re on an ‘optics forever’ path. EUV is gaining momentum and closing the gap, though the finish line is still several years away (and may keep moving).

Moore’s Law predicts the supply side of ICs, but the demand side can be understood as a “virtuous cycle” of technology advancement, lower costs, and rising demand leading to reinvestment.

In a bid to expand applications for 3D packaging, NEC has developed a 3D chip-stacked flexible memory to support large-scale high-performance systems-on-chip (SoC).

As device engineers are turning to material scientists to provide new materials for enhanced functionality of device platforms, the materials scientists are turning to chemists to provide new chemistries to realize novel functionality within the epitaxial deposition process.

Judging by the 2008 International Electron Device Meeting (IEDM), momentum continues to build toward eventual integration of compound semiconductors and mainstream silicon technology.

ISMI has been the leader in implementing small-lot manufacturing and single wafer processing for 300mm Prime and next-generation factory (NGF) 450mm manufacturing.

Through-silicon via (TSV) is an emerging technology for scaling, packaging, and continuing the drive to higher density and higher performance ICs.

The benefits of chip/package and chip/package/board codesign flows are realized only through early and frequent communications.