Issue

Where does innovation come from, and how can we foster more of it?

Mass flow controller (MFC) designs must evolve to meet the need for ever more precise control of chemical and gas precursors used in semiconductor manufacturing.

Random and systematic process variations reduce parametric yields significantly at the leading 65nm and 45nm CMOS process technologies.

Many emerging wafer bonding technologies are requiring higher applied force for successful wafer level encapsulations.

When process innovation is a requirement, a sound process development strategy is a must. Differentiation on silicon that is process- vs. design-based can hold very high returns for investors and technologists provided the innovation is accelerated via streamlined development efforts that understand both the development and the manufacturing challenges.

Nickel particles on silicon wafers are popularly used as catalysts in growing carbon nanotubes (CNTs).

Patterning of contact layers with minimal half pitch below 90nm has proven to be a very difficult task.

Automated material handling systems (AMHS) are critical to the infrastructure of a 300mm fab.

Advances in semiconductor lithography have driven the rapid growth of the semiconductor industry since its beginnings.

Amazingly, it is now 50 years since Sam Marshall launched Semiconductor Products magazine, which has evolved into today’s Solid State Technology and the web site at www.

Founding a semiconductor magazine, or company, in 1957 required a leap of faith.

A technology timeline from the editors of Solid State Technology