Issue



Table of Contents

Solid State Technology

Year 2005
Issue 9

ATTENDEES-CHOICE-AWARDS

Attendees Choose Lsquobe


Attendees choose ‘best-in-show’ products

Solid State Technology invited Semicon West attendees to vote on the best products they saw at the July trade show in San Francisco’s Moscone Center.


DEPARTMENTS

Editorial


Educating innovators

It was a rare quick exchange during Alan Greenspan’s testimony before a Senate finance committee.


World News


World News


Tech News


Technology News


Nanotechnology


Using advanced lithography to pattern nano-optic devices

Nano-optics - a class of highly compact, high-performance optical components that are readily customized and easily integrated with other optical devices and electronics - are of significant interest to both electro-optic circuit designers and manufacturers.


Tap


Higher throughput and yields from laser scanning projection in WLP

To meet the patterning needs of wafer-level packaging (WLP), the IC industry has relied on familiar contact printers and stepper systems.


Product News


Product News


Perspectives


A Roadmap perspective: Revisiting DFM

Solid State Technology asked experts to comment on the implications of Roadmap requirements on DFM.


FEATURES

Cover Article


Minimizing equipment downtime through advances in wafer handling

Production ramps in 300mm fabs have increased the emphasis on equipment availability.


Copper Low Ik I


Porous low-

It is essential to introduce porosity in carbon-doped oxides (CDO) to extend their applications to 45nm and beyond with k<2.5.


Photomasks


Determining printable defects with MEEF-based mask inspection

The aim of mask error-enhancement factor (MEEF)-based inspection is to increase photomask yields by adjusting defect specifications to exclude harmless aberrations and small defects that have no impact on printed devices at the wafer level.


Advanced Process Control


A comprehensive control strategy for maximizing process capability

Advanced process control (APC) has become a central issue in wafer fabs when it comes to quickly introducing new technologies into production or fine-tuning tool performance for maximum yields.


Chemical Handling


The effects of wet-etch parameters on wafer-thinning etchants

Designed experiments determine the effects of wet-etch parameters on the performance of several different types of wafer-thinning etchants.


DATA-STORAGE-SUPPLEMENT

Editorial


Sizzling markets spark memory innovation

The demand for memory used to be driven mainly by business applications. That sector continues to grow with the rise of the Internet, e-commerce, and e-tailing, and much more active product tracking in retail channels as well as for just-in-time (JIT) manufacturing.


Features


Micro-drives: Hard-disk revival driven by thirst for mobile storage

Rapid growth in consumer electronics, particularly for mobile applications, is driving a surge in demand for hard-disk storage, particularly micro-drives.


Features


System-on-Chip: Process integration solutions for 0.18μm embedded microFlash

Processing challenges have made it difficult to put flash memory on the same chip with CMOS logic.


Features


Hard Disk Drives: Magnetic head processing technology for small form-factor hard drives

Platform-based process equipment and integrated process and metrology tools will be pivotal in advancing reliable, economical manufacturing of small form-factor hard disk drives (HDD).


Departments


News & Products