Issue



Table of Contents

Solid State Technology

Year 2002
Issue 3

DEPARTMENTS

Editorial


Time for new thinking on fabs?


Letters


Letters from Readers


World News


Worldwide Highlights


Tech News


Technology News


Asiafocus


For process development and yield NEC uses in-line tool monitoring*

New work suggests that using different optical parameters can extend e-beam (EB) lithography down to 0.05μm, and improve its throughput by controlling the electron interactions that usually limit both resolution and throughput.


Market Watch


Battle heats up for growth market in implant


Product News


Product News


FEATURES

Cover Article


New barrier layers can help Cu/low-k integration


Cmp


Establishing the discipline of physics-based CMP modeling


Contamination Control


The detrimental effect of moisture in SiGe epitaxy


Industry Insights


Compound and silicon semiconductors: A technology duet