Issue



Table of Contents

Solid State Technology

Year 2003
Issue 8

DEPARTMENTS

Editorial


Does the Roadmap need more shortcuts to the future?

The Roadmap process has helped the semiconductor industry keep its entire manufacturing infrastructure moving forward at a rapid but synchronized pace, somewhat like rolling up a huge carpet without creating kinks and bulges.


World News


World News


Tech News


Technology News


Feol


The industry's worship of Ra in gas system plumbing

In our modern world of semiconductor manufacturing, Ra is the symbol for average roughness of a surface (Roughness average).


Interconnect


Developing sub-90nm low-k/Cu solutions

The adoption of low-k materials into Cu damascene device structures has taken longer and required more work than anyone in the semiconductor industry had predicted.


Products


Products


Perspectives


The future of SOI and strained Si

Solid State Technology asked IC manufacturers and a developer of strained silicon to comment on the roles of both strained silicon and SOI in future device technology.


FEATURES

Cover Article


Simplifying multiple VT process flows using chained implants

Below the 100nm node, it is impossible to simultaneously meet drive current and gate leakage specifications for leading-edge devices using SiO2 or SiON gate dielectrics. This has forced the fabrication of multiple transistor designs in a circuit.


Etch


Correcting HDP film thickness with a wet pre-planarization etch

Precise control of chemical mechanical planarization is becoming increasingly important, and uniformity is greatly influenced by the step and height of patterns.


Topography Reduction For


Topography reduction for copper damascene interconnects

Surface topography variations (currently >4000Å) within-die, die-to-die, and across the wafer, are major obstacles for the copper interconnect process today.


Its Time For Fabs To Use


It's time for fabs to use XPS, SIMS, and Auger

IC manufacturing always has been supported by metrology techniques that first prove their value in a laboratory setting and then transition to production applications.


Chemical Handling


Optimum process performance through better CMP slurry management

Within wafer fabs where processing is done largely through the manipulation of ions and photons, chemical mechanical planarization and its slurry seem somewhat industrial.


ASIA-PACIFIC

News


News


Cover Article


Growing a high-tech business in China

As the rest of the world continues to stagnate, the semiconductor industry in China is not standing still. With double-digit economic growth last year, electronics manufacturing in China is booming as high-tech companies pour investment into ventures all along the value chain.


Asian Foundries


The changing future of the Asian foundry landscape

As the semiconductor industry recovers from its worst ever global economic downturn, we should begin to see both fabless companies and IDMs increase their demand for foundry capacity.


Foundry Capacity


Are foundries adding too much capacity?

Foundries have transformed the way chips are made and because of them, Asia Pacific is fast becoming the center of the industry's manufacturing. With the success of the foundry model, more companies are moving into the neighborhood.


Korea


Forging partnerships to build a plant in Korea

Korea's economy has been growing at 5–8% annually for many years, due in part to the success of foreign companies that have established operations there.


Malaysia


Taking a business concept from greenfield to top-tier foundry

Wafer foundries have become an integral part of the semiconductor economy. Some analysts have forecast that foundries' share of wafer shipments will reach more than 40% of total volume within 10 years.


General Asia


Asia Major: Partners mean profits

Today, the media overflows with news of turmoil in Asia: war-posturing on the Korean peninsula, theft of intellectual property in China, ethnic unrest along the Pacific Rim.