Issue

At a recent Semi breakfast, Doug Neugold, president of ATMI, suggested that Gordon Moore didn't really propose a Law in 1965.

Regarding SST's October feature article, "Angle control in high-current ion implanters" (p. 39, by Leonard Rubin of Axcelis Technologies Inc.), the author's assertions can be accepted for legacy technologies.

Global chip sales reached $12.68 billion in November, a 1.3% sequential increase from the $12.51 billion in revenue reported in October.

Though EUV lithography may not be on the ITRS roadmap until 2008 or so, it looks as if it is rapidly starting to become a key focus of International Sematech's mask program.

Today's optical lithography simulators can typically calculate areas of about 10 ¥ 10µm2.

Due to shrinking geometries, the ITRS roadmap indicates that ALD processes will be required starting at the 90nm node for a variety of applications: deposition of barriers, nucleation layers, and high-k dielectric materials [1].

Trench depth is a critical parameter affecting performance characteristics in many current semiconductor applications, including shallow trench isolation and power discrete vertical MOSFETs.

Prospects and challenges of optical RET

Photostabilization, also known as deep-UV (DUV) hardening, has been in the mainstream of semiconductor manufacturing for more than 20 years, primarily for i-line resists, where it is still effective at improving process performances at ion implant levels.

Traditionally, within wafer fabs, operations managers adopt one of two overarching vacuum equipment maintenance philosophies ...

China is the sixth largest economy in the world and the only trillion dollar economy expected to double in the next decade.

China's large potential semiconductor industry market, along with increasingly favorable governmental policies, has attracted many foreign enterprises to the country.

Interest in China as a contender in the global semiconductor market is exploding.