DEPARTMENTS
Editorial System-on-a-chip: Not as easy as it looks
Long ago, a chip architect pointed out to me that the only thing integrated circuits are about, really, is packaging.
Letters Water and chemical use
Senior Editor Pete Burggraaf's article "A Closer Look at Some of the Most Difficult Processing Challenges" in the September 2000 issue of SST was extremely informative, particularly the section on solutions for saving water on p. 90.
World News World News
Worldwide Highlights; USA; Europe; Taiwan; AsiaPacific; Japan; and Investment Briefs.
Tech News Technology News
Reticle inspection enters the deep-UV; Hyundai takes on wafer-level packaging, test with FormFactor license; LG.Phillips' TFT LCDs: Low-temp polysilicon with fewer masks ...
Bacus Report BACUS reveals latest trends in RET, etch, and e-beam
More than 600 attendees of the 20th annual BACUS Symposium on Photomask Technology discussed the latest efforts to optimize application of reticle enhancement technology (RET).
Asiafocus Bridging the gap between packages and chips: 10mm super connect technology*
There's fast-growing interest in Japan in the potential of 5-15mm technology, that long-ignored middle region between packages and semiconductors.
Eurofocus EuroFocus
Siemens plant to reopen; Schlumberger opens center in Italy; Euro Briefs.
Market Watch What will replace the PC in the DRAM market?
It is always safe to predict change in the volatile DRAM market. To forecast the kind of change and its consequences is more challenging.
The overall DRAM outlook is good. Revenue is forecast at a compound annual growth rate of 31%, unit shipments at 13%, and megabit growth at a healthy 61%.
Calendar Calendar
A calendar of industry-related events; runs November 2000 to March 2001.
People People
Pac Tech GmbH, Menlo Park, CA, has appointed Ron Blankenhorn president and chief executive officer for its US operations. Blankenhorn has more than 23 years of ...
New Products New Products
Step-and-repeat scanning system from Nikon Precision Inc., Belmont, CA; Innovative RTP tool from ASM International N.V., Bilthoven, Netherlands; High-speed linear wafer track from B.L.E. Laboratory Equipment GmbH, Radolfzell, Germany; Laser probe system for flip chips from Jets Technology, Santa Clara, CA ...
New Literature New Literature
Fixed gas detection catalog from Scott/Bacharach Instruments LLC, Exton, PA; Laser-based gauging sensors literature from Laser Measurement International, Industrial Sensors Division, Southfield, MI; Porous metal technology brochure from Mott Corp., Farmington, CT.
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