Issue



Table of Contents

Solid State Technology

Year 2001
Issue 1

DEPARTMENTS

Editorial


Welcome to the REAL New Millennium

A few of us still believe that the new millennium really began this New Year's Day rather than a year earlier.


Calendar


Calendar

A listing of industry events.


World News


World News

Worldwide Highlights; USA; Europe; Japan; Taiwan; Asia-Pacific ...


Tech News


Technology News

US Air Force lab develops defect analysis for GaAs wafers; Curious-looking device bends light with little loss ...


Eurofocus


Electronica 2000 breaks all records

With an exhibition space of 160,000 m2, 3050 exhibitors, and an additional 580 represented companies, Electronica 2000 broke all records last year.


Asiafocus


New scanning technique: Will it make coating the low-cost alternative for low-k films?*

Tokyo Electron Ltd. and Toshiba Corp. plan to introduce new scan-coating equipment this year that could significantly reduce the cost of making low-k dielectric films, and, eventually, of applying resists as well.


Market Watch


The lithography equipment marketplace

Several factors shape the lithography equipment sector compared to the total equipment market, including the huge cost of the equipment, the volatility of tool sales, the major players, and the extendability/limits of current optical technology.


Show Report


Interface conference shows optical lithography's milestones

Exposure tools and resists for 157nm lithography are still very much in the laboratory; 193nm lithography is making some progress in broad development, perhaps slightly behind its anticipated learning curve, but workhorse 248nm lithography continues to make somewhat remarkable progress.


FEATURES

Industry Insights


Demographic dynamics driving industry's human capital management

More applications for ICs have led to the need for more fabs, more equipment, more materials and more people. However, fewer people are available with interest in our industry and the skill sets we need.


Implantation


Transistor performance: the impact of implant doping accuracy

Transistor fabrication requirements are emerging as the next critical set of challenges to continue ITRS-driven progress. Doping accuracy for parametric and conductive implant applications is especially important for sub-0.13—m-generation devices.


Cover Article


Process technology update: Progress on all fronts

The creation of ultra-shallow junctions (USJs) has driven significant recent developments in ion implantation, thermal processing, and metrology. Lenny Rubin, principal scientist at Axcelis Technologies, reports that the challenges for the near future are now less scientific and more in the area of equipment engineering ...


Chemical Handling


In situ endpoint control saves chemicals in wet processing

Investigation of endpoint detection, using cost of ownership analysis, on a pre-lithography backside film-removal step helped to determine how the capital investment of an endpoint detection system affects the cost/good wafer equivalent.