DEPARTMENTS
Asia Pacific
The Challenges and rewards of local manufacturing in Japan
Local manufacturing of US products in Japan is not a new concept, but such ventures are unusual in the semiconductor equipment industry. A successful partnership must be able to offer high-performance technology tailored to meet the specific requirements and specifications of the Japanese semiconductor industry.
Asia Pacific
Materials issues in 2000/2005
The demand for semiconductor devices is continuing to increase at such a rate that the number of devices produced worldwide in the year 2005 is expected to be 10? 1996 levels. The amount of materials consumed, and the waste materials discharged, could increase proportionally. Resource conservation and other environmental issues, however, mandate that the expected increase in output must be accomplished without a proportional increase in material consumption or waste generation.
Asia Pacific
Hitachi reorganizes
With pricing pressures in the DRAM sector persisting, Hitachi is shifting its emphasis. The company is undertaking a major reorganization of its chipmaking operations, breaking what is now a single division into four separate units oriented around particular product lines. The Nihon Keizai Shimbun reported that the Hitachi board has authorized a split into operations for system LSI, DRAM, system memories (e.g. flash), and general purpose products (including discretes).
Asia Pacific
Asias equipment supply: Buying and selling used
In certain situations, adding used semiconductor manufacturing equipment to your production line is a good choice; increasingly, this is a viable choice for the growing semiconductor industry in Asia. Finding the right piece of equipment and a reasonable price, however, requires knowledge of buyers and sellers and the dynamic in the used equipment market. Here is a valuable check list of what to do and not to do.
Asiafocus
MEMS program at Sinapores Institute of Microelectronics
The Institute of Microelectronics (IME), Singapore, is a multidisciplinary research institute specializing in core areas of microelectronics. The mission of this applied R&D organization is to help nurture microelectronics industries in Singapore. One of the application areas IME has chosen to develop is the industrially important field of microelectromechanical systems (MEMS). IME has been working closely with several multinational companies to bring MEMS products to the industry.
Lithography
Optical lithography below 100nm
Optical lithography has been the primary patterning technology for IC production for 30 years. Momentum and astounding improvements in resists and optics have forestalled the introduction of more complex alternatives. How much longer is this likely to continue? Various improvement paths with alternate lens and system tradeoffs indicate that there is still headroom left, and that the end of optical lithography is below 100 nm - probably close to 70-80 nm.
Editorial
1999 looks like a very busy year
While semiconductor fabrication has undergone some dramatic changes throughout its history, in recent times the industry has settled on digital CMOS circuits on silicon. By far, this represents the bulk of today`s processing, with a little BiCMOS and some gallium arsenide sprinkled here and there for special applications. Silicon dioxide has proven to be a very handy dielectric, with aluminum, tantalum and titanium for conductors and vias.
Eurofocus
Europe: A worldwide player
The European semiconductor industry was riding on the crest of a wave during the first half of 1998, but with the worldwide semiconductor downturn, the European industry has fallen as well. The most visible indication of this is the announced closure of Siemens` new flagship wafer fab in North Tyneside, UK. Despite this shutdown, the fundamentals are still looking good for European companies. Over the last few years, they have been experiencing strong growth and gaining market share in the manuf
Eurofocus
Dual damascene aluminum for 1-Gbit DRAMS
Roy Iggulden,* Larry Clevenger,* Greg Costrini,* David Dobuzinsky,* Ronald Filippi,* Jeff Gambino,* Chenting Lin,** Florian Schnabel,** Stefan Weber,** IBM*/Siemens** DRAM Development Alliance, Hopewell Junction, New York
Market Watch
Companies outsource to concentrate on core business
As the semiconductor industry gets more complicated, chipmakers are finding it worthwhile to outsource some fab operations and lease some process equipment. While outsourcing is not a new idea, the current hard times are increasing its use. With cycle times and the number of personnel shrinking, companies want to shed tangential operations so they can concentrate on their core businesses.
Market Watch
Automation, integration and data management for the back end
A comprehensive solution to the demanding automation and integration needs of test, assembly, and packaging - semiconductor manufacturing`s back end - is essential to improving fab productivity. From extensive experience with field-proven automation systems and customer feedback, here is a proposed architecture for future test, assembly, and packaging manufacturing environments. This architecture accommodates the qualities most valued by the industry, such as modifiability, integration ability,
Japan Products
Automatic BG tape laminator and remover
The Adwill RAD-3500F/12 fully automatic BG tape laminator handles 150-, 200- and 300-mm wafers. The system features a tape tension control system that allows the most suitable tape lamination to be used on the wafer circuit surface. Damage to wafers due to an intrusion of the chip into the backgrinding process is eliminated. Processing capacity is 80 uph. The Adwill RAD-3000F/12 is a fully automatic tape remover designed for the 300-mm wafer backgrinding process. The system emphasizes the safe
Japan Products
High-speed bump bonder
This high-speed bump bonder, with die tray auto loader, is designed for mass production of chip-scale packages and ball grid arrays. Bumps are formed directly onto the pad of die supplied from the tray by gold ball bonding. Other features include: a loader/unloader destacking 4-in. die tray; leveling function after bumping; and a light bonding head and vibration-prevention structure to ensure stable bondability. Machine accuracy is ? 5?m and bonding speed is 0.08 sec/bump (varying according to d
Japan Products
Mapping sensor
The F3M-S mapping sensor allows the mapping of cassettes that have both silicon and glass wafers. The sensor automatically detects inexpensive opaque dummy wafers, with a transparency rate of 92% max, used for process checks. There is an automatic teaching function that ensures easy output adjustments within a minimal time, and there is a remote teaching function that ensures easy output readjustments. Omron Corp., Osaka, Japan; ph (US) 847/843-7900 ext. 298; fax 847/839-2298.
Japan Products
Cryogenic probing stations
The Model BCT series cryogenic probing system operates without liquid helium or nitrogen and can measure semiconductor parameters and microwave characteristics in the 4K to 150?C (max) wide range. The high insulation stage, low-noise probe head, cable, connector, complete shield chamber, and clean vacuum combine to decrease measurement typical noise level to <1 pA and to measure microwave characteristics up to 60 GHz. Model CCT series is a fully automatic cryogenic probing station. It includes a
Japan Products
Die bonder for small lots
Developed as a robot for use in the production of small lots of many types of semiconductors, this system comprises a Scarates dual-arm scalar robot; a chip vacuum chuck head (including centering mechanism); a leadframe handling unit; a robot controller; a dispenser controller; a wafer station (X, Y, and theta table); a centering tool microscope; a leadframe station; a chip mount stage; and a magazine station (with elevation adjustment mechanism). The right arm handling unit takes a single lea
Literature
Photoresist adhesion promoter packet
The nonaminic advanced priming system (NAAPS), a new, patented technology for use in priming substrates and promoting uniform photoresist film formation, is described in this packet. Operating as a drop-in replacement for hexamethyldisilazane, and without problems associated with the generation of ammonia or amines, the system benefits CD control, can eliminate T-topping due to ammonia exposure, and may eliminate the requirement for a protective top coat. It can function with all positive photor
Literature
DUV brochure
Deep ultraviolet (DUV) measurement and calibration products are featured in this brochure, including DUV exposure meters, and energy and power meters. Products like the EM 500e are lightweight and portable. Others, such as the EPM2000e or the OM4001e, are multichannel measurement systems complete with high rep rate and statistical analysis capabilities. All include National Institute of Standards and Technology (NIST)-traceable calibration. Molectron Detector Inc., Portland, OR; ph 503/620-9069,
Literature
On-line sealing handbook
The Right Seal guide to sealing in semiconductor manufacturing processes can now be accessed on the internet. Introduced in hard copy form in 1997, the handbook provides detailed technical information on a range of seal types and materials, and was developed specifically for professionals who design equipment and select seals and sealing materials for semiconductor fabrication. Information is provided on semiconductor sealing requirements; O-ring, Dovetail, and MSE seals; and specialty applicati
Literature
Microscopy Magazine
Innovation Lambda: Magazine of Microscopic Imaging and Analysis is a new publication available to microscope users. The magazine discusses innovative products, introduces readers to new image analysis software, and describes solutions to problems in widely varied applications. Written by practitioners for practitioners, it avoids difficult technical terms and is available in both German and English editions. It will be published four times a year. Carl Zeiss Jena GmbH, Microscopy, D-07740 Jena,
Literature
E-beam moire publication
Highlighted in this brochure is the relatively new electron-beam (e-beam) moir? technique that measures submicrometer strains on a local scale in electronic packaging. The publication describes the background, setup, and procedures for the technique, and is intended to give readers enough information so that they can conduct an experiment in their own laboratories. Such experiments would include a scanning electron microscope, access to e-beam or another lithography process, and computers to ru
Literature
ICP mass spectrometry
The VG Axiom, an inductively coupled plasma (ICP) mass spectrometry instrument for high-resolution and multicollector functions, is highlighted in this four-color brochure. The tool interfaces a double-focusing magnetic-sector mass spectrometer to an ICP ion source, and features a computer-modeled design, simplified control electronics, a detector system, an M-PlasmaScreen, and an up-to-date software suite. The brochure also describes VG Axiom`s compact design, which allows a small footprint and
Literature
Mass flow meter data sheet
Technical literature on the Model 640-S Smart Insertion mass flow meter is provided in this new data sheet. The microprocessor-based transmitter integrates the functions of flow measurement, flow-range adjustment, meter validation, and diagnostics in a compact, explosion-proof housing. Mass flow rate and totalized flow, as well as other configuration variables, are displayed on the meter`s backlit LCD panel. The programmable transmitter is configured via a RS-232 com port or the display and memb
Literature
Gas analysis
This six-page brochure describes improvements in the Transpector 2 gas analysis system, a quadrupole-based smart sensor that contains sensor drive electronics and a microprocessor in a compact enclosure attached to the sensor. New RF and preamplifier electronics provide accurate data for vacuum process monitoring, process diagnostics, and leak detection in semi-conductor manufacturing. Increased hydrogen sensitiv-ity makes contaminants visible at sub-ppm levels, and faster scanning over low-lev
Literature
Glass components catalog
This newly updated catalog contains a range of borosilicate and quartz glass flanges and fittings, as well as corresponding chain clamps and seals for numerous applications, including R&D, ultrapure water, vacuum technology, and semiconductor processing. Up to NW 50 the flanges and fittings are compatible with KF; transitions from glass to metal flanges are made easy with adapter seals. Also included in the catalog are new high-temperature versions of the chain clamps. Sizes of the components ra
Literature
O-ring and seal reference guide
The updated O-ring and Seal Material Reference Guide (ORD5703A) provides the O-ring specifier and designer with a 44-page source for basic size, gland design, and material information on O-rings. New compounds such as Parofluor (perfluorinated fluorocarbon), Hifluor (highly fluorinated fluorocarbon), HNBR (hydrogenated nitrile), and Aflas (tetrafluoroethylene propylene copolymer) elastomers are included, as well as revised ASTM, NAS, AMS, SAE, and military specifications. A new compatibility ta
Literature
Temperature products catalog
Information on a line of temperature, air velocity, and humidity-related equipment is offered in this 40-page catalog. Among the items featured are handheld thermocouple thermometers (including single and multiple inputs and dataloggers with infrared printer ink); a selection of Type J, T, E, K, R, S, and infrared probes; smart temperature controllers; RTDs; thermistors; a handheld unit that measures air velocity, temperature, and humid-ity; and an assortment of accessories, including field kits
Literature
Heated vacuum value brochure
This 16-page, color brochure details a line of vacuum valves designed to be used in semiconductor processes like low-pressure CVD, where production by-products can condense and build up. Because the poppet-style HPS Jalape?o vacuum valves are heated to a minimum internal temperature of 150?C, by-products that would interfere with the operation of conventional valves are changed to gases. The valves are available in angle and in-line models with seal, limit switch, and solenoid options, and their
Literature
Transport module controller data sheet
This data sheet describes the Techware 5 Express, a standard controller for Marathon Express cluster tool automation platform configurations and components, including the MagnaTran 7 robot, the VCE 6 cassette elevator, and the drop-in in-cooler. With support for both direct and distributed I/O, a small form factor, and a scalable architecture, the tool can also be deployed for thin-film process control. The data sheet also details other features of the instrument, such as its CE-marked, industry
Product News
In situ photoresist sensor
This in situ sensor detects unwanted photoresist in the wafer de-gas stations of PVD systems. Fully integrated into PVD cluster tools, the detector interrupts the processing of any wafer that enters a vacuum processing system with detrimental levels of residual resist. High sensitivity and fast detection allow alarm triggers to halt the process before resist-contaminated product progresses through the tool. The tool is then stopped automatically, with no operator intervention. Spectra Internatio
Product News
Portable cleanroom
The 200-mm Portable Clean Room is a hand-carried microenvironment, for worldwide wafer transport. It has two sections: a base housing and a wafer chamber. The sealed chamber is designed to maintain a positive pressure nitrogen ambient for more than three days to protect against airborne molecular contaminants (amines, etc.), oxygen, and particulates. The base housing accepts a standard wafer cassette and has two side carrying handles; it also contains a chamber pressure gauge, a pressure relief
Product News
Wet bench construction material
Corzan 4910 CPVC white sheet material is designed to blend strength, weldability, and chemical resistance. It is suitable for wet bench construction, meeting FM4910 Corporation Class requirements, and is a candidate for recognition under the FM4910 test standard for cleanroom materials. (The three main criteria in FM4910 are fire propagation, smoke damage, and corrosion damage.) Corzan 4910 is a good alternative to flame-retardant polypropylene and does not require additional fire-suppression eq
Product News
Automatic visual wafer inspection
The WAV-1000 system, for the automatic visual inspection of wafers, accommodates post-probe or pre-probe inspection. It is optimized to detect a full range of defects, such as contaminants, voids, scratches, and peels, and it improves yield by eliminating the tendency of operators to over-mark during the visual defect inspection that follows electrical probing of wafers. WAV-1000 requires <5 min for inspection of a 150-mm wafer at 5-?m resolution and accommodates wafer sizes of 5, 6, and 8 in. T
Product News
Die sorting system
Model 2010 is a die demounter that can easily remove a fully sawn wafer from a film frame in <30 sec. Die as small as 0.01 in.2 can be peeled quickly and easily without damage. Wafers with 1-6 in. diameters can be demounted (an 8-in. model is also available). The machine is semiautomatic; the operator places each wafer on the machine and the die are then separated and spread loosely on a removable tray, while maintaining their original orientation. The tray can then be taken to another area for
Product News
Teflon wafewr carriers
EPI Teflon wafer carriers are molded and precision-machined from a single piece of PTFE or PTFM in sizes that handle wafers from 3 to 12 in. Free of microvoids and microporosity, the seamless carriers can incorporate slots, bars, and precise hole locations with tolerances to 0.003 in., depending on configuration; they have no pins, screws, or dovetails that can trap contaminants. The carriers operate from -450 to +500?F, have low extractables, and their low coefficient of friction almost elimina
Product News
Wafer-handling system
The WHU300 provides chipmakers with a complete wafer movement solution for their process tools. It is designed to receive a SEMI-standard FOUP, orient it, open it, and transfer wafers to the process station. Once the wafers are processed, the WHU300 returns them to the FOUP. Each WHU300 is customized for the specific tool and fully integrated into the process chamber technology. Automation Modules Inc., Fremont, CA; ph 510/661-2900, fax 510/252-1690, www.amirobotics.com.
Product News
Variable-speed sectioning saw
The TechCut variable-speed sectioning saw has features that include: dual cutting modes - constant sample advancement or pre-set sample load; variable blade speeds of 100-4000 rpm; automatic sample advancement via a y-axis table; 3-7 in. blade capacity; cutting capacity - sample length of 6 in., 2 in. thick; and an optional z-axis stage for height control. Allied High Tech Products Inc., Rancho Dominguez, CA; ph 800/675-1118, www.alliedhightech.com.
Product News
UHV rotary stage
The UHVL-RS rotary stage, for ultrahigh vacuum, is designed for the most precise alignment applications, such as aligning defraction gratings, rotating samples in thin-film processes, and wafer processing and inspection. The stage incorporates proven piezoelectric technology in a design that provides a new degree of freedom in ultrahigh-resolution rotary positioning. Precise positioning is achieved by converting the linear motion of a UHVL-045 INCHWORM motor to ? 15? of rotary movement, using a
Product News
High-vacuum diffusers
The Key High DF series diffusers are designed to introduce large quantities of gas quickly into a vacuum chamber or loadlock during the venting of a process. They break up the incoming gas stream evenly and uniformly. Components feature a standard ISO interface flange, allowing the use of a bulkhead clamp to the chamber with a 1/4-in. VCR fitting for rapid installation into a system. All machined components are manufactured to at least 32 Ra finish and electropolished. Construction of the DF ser
Product News
Optical emission monitor
Designed for plasma diagnostics and endpoint detection, the INTELLUX 400 is a transducer-type, microprocessor-based, multichannel optical monitor with RS-485 and DeviceNet interfaces. It can accommodate up to four independent optical inputs processed through a common or individual band pass filter. The filters are available in the 200-1000 nm range . Using high-sensitivity UV-enhanced silicon detectors and offering a wide dynamic range of remotely adjustable gain settings, each channel accommod
Product News
Cluster tool
This multiwafer, batch-processing cluster tool is designed for low-pressure CVD and ultrahigh vacuum CVD films. It simultaneously processes a boatload of wafers in each of the three process chambers in a manner similar to that of a single-wafer, multichamber cluster tool. The system has three independent process chambers, a loadlock, and a robotic transfer chamber to move the wafer boat between process tubes and the loadlock under an ultrahigh-vacuum condition. CVD Equipment Corp., Ronkonkoma, N
Product News
Residue-removal chemistries
EKC525 Cu removes post-etch residue from copper substrates where low-k dielectrics are used, providing an ultraclean surface while eliminating any harmful effects on copper or low-k dielectrics. EKC505 Cu removes photoresist on copper substrates and eliminates swelling, bowing, or delamination of low-k dielectrics. EKC450 cleans downstream post-etch and ash residues and is compatible with low-k dielectrics and associated etch processes. EKC150 is a combination bulk photoresist and post-etch resi
Product News
Flow sensors for corrsive liquids
Series 106 Flo-Sensors measure very low flow rates from 15 ml/min to 10 l/min with ?1% accuracy. They have onlyTeflon and sapphire as wetted surfaces and can replace conventional glass tube and ball flow meters in applications where an electrical signal proportional to the flow rate is desirable. The sensors can even be used in very corrosive applications where the liquid is low in viscosity (<10 Centistokes). A Pelton-type turbine wheel determines the flow rate of the liquid being measured; th
Product News
CMP robot
The RR721 water-resistant robot series, for 300-mm CMP applications, features dual-arm architecture, a splash-proof upper body, and a 300-mm Z-axis stroke for 25-slot 300-mm FOUP access. The upper arm uses a rotating wrist joint for 180? wafer rotation, and "Vacuum-Grip" for quick transfer of wet wafers. Lip seals on all joints and a splashguard ring protect internal robot components. Rorze Automation Inc., Milpitas, CA; ph 408/935-9100, fax 408/935-9101, e-mail [email protected].
Product News
Quick-disconnect couplings
ChemQuik CQH quick-disconnect couplings have a completely clear flow path and are designed to make possible instant disconnection during fluid transfer, from aggressive chemicals to ultrapure water. The couplings are made of polypropylene, making them resistant to a wide variety of chemicals and acids. This chemical tolerance suits the couplings to such applications as CMP filter service, chemical transfers, and drain lines; their noncontaminating qualities also make them suitable for ultrapure
Product News
Low-profile pressure transducer
Model TLD is a high-performance, low-profile pressure transducer/local display that meets the stringent standards of semiconductor pressure measuring applicatiions. Manufactured in a Class 10 cleanroom, it features 316L VIM VAR stainless steel parts with an electropolished wetted surface finish of 5-Ra maximum. Overall height is 3.5 in. The transducer`s signal amplifier is mounted within the display, with zero and span adjustments located on the display face. TLD models are offered in flow-throu
Product News
PTFE chemical valves
These large-diameter (14 through 24 in.), high-performance PTFE butterfly valves have been added to the Series 22/23 line, in both wafer and lug bodies, and offer the same chemical resistance of PTFE seats and encapsulated discs as the previously available 2 through 12-in. sizes. The bi-directional pressure rating for the large sizes is 150 psi (10 bar), and the temperature range is -40 to 392?F (-40 to 200?C). The new size range also features the same energized stem sealing system that fully is
World News
World highlights
North American semiconductor equipment makers logged orders of just $631.5 million in August, half the level of six months earlier and almost 15% below July (see table). Companies shipped $1.06 billion worth of products. The resulting August book-to-bill ratio is just 0.6 - among the lowest ever recorded by SEMI.
World News
USA
Motorola`s Semiconductor Products Sector has decided to indefinitely postpone work at its Richmond, VA, fab, less than a year after rebooting the $3 billion project there. A spokesman said construction is being put on hold because of the poor state of the chip market, and will begin again when the market "returns to much better than it is." The company is also planning other capital spending cuts in the group.
World News
Japan
Japan-based Kokusai has merged its Kokusai BTI Corp. and Kokusai Semiconductor Equipment Corp. units into a single organization known as Kokusai Semiconductor Equipment Corp. (KSEC), headquartered in San Jose, CA. The move was made in an effort to present a unified face to North American buyers of its CVD and diffusion equipment. KSEC was set up to support Asian chipmakers who were building fabs in the US, while the BTI unit had an existing sales force as well as engineering and manufacturing gr
World News
Asia / Pacific
Taiwan semiconductor consortium. Taiwan`s government-sponsored Electronics Research Service Organization will be involved in the formation of a SEMATECH-like research consortium on the island. Taiwan Semiconductor Industry Association members will contribute 50% of funding, with the government paying the other half. With the decision to form the consortium only recently taken, most details remain to be worked out.
World News
Europe
Siemens AG is making a rapid exit from the 16-Mbit DRAM market with plans to close its 15-month old DRAM fab in North Tyneside, England. The chipmaker`s semiconductor group recently reported losses totaling more than DM1 billion ($564 million) and suffered a significant setback when Taiwan`s Mosel Vitelic ended a contract to buy 50% of the UK fab`s output for the next 10 years. With the exception of a 16-Mbit DRAM joint venture with IBM in France, the company is converting its existing lines to
Tech News
Wafer-level burn-in will cut times and cost
Motorola Semiconductor Products Sector and Tokyo Electron (TEL), with the help of W.L. Gore and Associates, are on track to be the first in the semiconductor industry to qualify wafer-level burn-in processing - burn-in testing of ICs while still in wafer form. This new technique is expected to cut conventional IC manufacturing cycle time by up to 25% and direct manufacturing costs as much as 15%. And, it is likely that the new technique will reduce new-IC development time and future capital inve
Tech News
In situ process could cause scientific revolution
A mobile instrument being rolled around Bell Labs could change in situ particle detection during wafer processing from an art to a science and could have a major impact on semiconductor manufacturing. The experimental instrument can determine, in real time, the size and complete elemental makeup of particles from 0.9 ?m down to 1 nm in vacuum and atmospheric pressure wafer processing systems. It seems particularly well suited for detecting particles =0.2 ?m where they lose the ability to be dete
Tech News
Japans ASET researches EUV litho
In a move that may suggest a broadening of enthusiasm for extreme UV lithography technology, Japan`s government-funded Advanced Semiconductor Equipment Technology (ASET) organization has begun a program that will bring a group of about 30 researchers together to concentrate on EUV. Stepper vendor Nikon will be a leading participant.
Tech News
Hiroshima SSDM meeting overview
The International Conference on Solid State Devices and Materials (SSDM), held in Hiroshima, Japan, recently, featured a rump session on future silicon substrates, which included a panel discussion of 300-mm, 400-mm, and ball-shaped materials.
| 
