FEATURES
Feature Products Semicon West '99 Product Spotlight
The product spotlight is an exhibition of innovative equipment and tools to be presented at the show.
Cmp Processing With Low CMP processing with low-k dielectrics
Migrating to low-k dielectrics for interconnects will dramatically alter CMP requirements, even when the new material is buried in a stack.
Lithography Favored SCALPEL's continued progress
The industry has made significant moves toward commercializing scattering with angular limitation projection electron-beam lithography, one of International Sematech's next-generation lithography methods funded in 1999.
Simplified Interconnect Simplified interconnect processing for cost-sensitive chips
The clever combination of several new process technologies allows for interconnect formation using one-third of the steps needed by conventional methods.
Front Page Ozonated water for photoresist removal
Improvements in ozone generation and the use of additives that prevent early decomposition of ozone have facilitated ozonated DI water resist stripping and surface cleaning of metallized wafers
Feature Choosing capillaries for fine pitch bonding
Software analysis enables optimization of wire-bonder capillary selection, leading to improved wire bond quality and stronger bonds, particular for <100um pad pitches or applications at reduced temperatures.
Feature Cobalt silicide processing in a susceptor-based LP-RTP system
The process control achieved by a susceptor-based RTP tool improves the process window for cobalt silicide formation.
Deposition Tailoring sputtered Cr films on large wafers
Two new approaches for sputter depostion of uniform low-stress chromium involve post-eposition film treatment by RF Plasma and a multistep process that alternates depostion and surface plasma and a multistep process that alternates deposition and surface plasma treatment.
Fab Management The
Automated individual wafer tracking can eliminate misprocession and lower material costs by detection and correction wafer-handling errors, and can check test wafer contamination levels. Both processes provide manufacturing cost savings.
Industry Insights A time for change in creating international standards
Appropriate standards are necessary to deliver products and services efficiently to a global market. While traditional standards bodies have served the industry well in the past, new mechanisms for setting some standards are being forged to keep pace with today's rapidly changing technology.
Vacuum Technology Management of TEOS LPCVD process effluents
TEOS LPCVD processes tend to clog the vacuum pumping foreline with effluent byproducts that can increase particle levels, impede gas flow, and cause catastrophic pump failure.
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